⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2733367 | 0.56 | — | — | |
| Cyclopropane SCHEMBL10931524 | 0.44 | CASP1 (0.42) | — | |
| SCHEMBL29900242 | 0.43 | — | — | |
| SCHEMBL10414868 | 0.43 | NQO1 (0.50) | — | |
| SCHEMBL29876207 | 0.43 | — | — | |
| SCHEMBL29485005 | 0.43 | — | — | |
| SCHEMBL175612 | 0.43 | CASP1 (0.50) | — | |
| SCHEMBL8465809 | 0.43 | CASP1 (0.50) | — | |
| SCHEMBL25853 | 0.43 | — | — | |
| SCHEMBL9583239 | 0.43 | CASP1 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7614145-B2 | Method for manufacturing multilayer circuit board and resin base material | ZEON CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-20080217617-A1 | Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same | ZEON CORPORATION (JP) | 2008-09-11 | — | — | US | disclosed |
| CN-100383278-C | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board | ZEON CORP (JP) | 2008-04-23 | — | — | CN | disclosed |
| US-20050153059-A1 | Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board | ZEON CORPORATION (JP) | 2005-07-14 | — | — | US | disclosed |
| CN-1639384-A | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board | ZEON CORP (JP) | 2005-07-13 | — | — | CN | disclosed |
| US-20040237295-A1 | Multilayer circuit board and resin base material, and its production method | ZEON CORPORATION (JP) | 2004-12-02 | — | — | US | disclosed |