SCHEMBL4355668

SCHEMBL4355668

Cc1nn(Cc2ccccc2)c(C)c1C#N

nearest known ligand 0.73

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.73
KDM4E B2RXH2 2/20 0.59
POLB P06746 3/20 0.59
NPC1 O15118 1/20 0.51
LMNA P02545 1/20 0.51
GAA P10253 2/20 0.50
KMT2A Q03164 3/20 0.47
AR P10275 1/20 0.47
MEN1 O00255 2/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
ALDH1A1 P00352 4/20 0.46
MAPT P10636 2/20 0.46
HPGD P15428 2/20 0.46
BRD4 O60885 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7303767 0.84 TSHR (1.00) TSHRKDM4EPOLBGAAKMT2A
SCHEMBL23116895 0.83 TSHR (0.68) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL12281117 0.78 KDM4E (0.69) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL1233545 0.75 TSHR (0.50) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL10186934 0.75 KDM4E (1.00) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL28355094 0.75 KDM4E (0.65) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL23402993 0.75 KDM4E (0.65) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL8444618 0.74 POLB (1.00) TSHRKDM4EPOLBNPC1LMNA
SCHEMBL5024112 0.73 GAA (0.64) KDM4EPOLBNPC1LMNAGAA
SCHEMBL13861497 0.73 TSHR (0.42) TSHRKDM4EPOLBLMNAGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed