SCHEMBL4357650

SCHEMBL4357650

CCCCCCOOOC(=O)CCCCCC(C)(C)C

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.46
LMNA P02545 3/20 0.40
DNM1 Q05193 1/20 0.40
PAM P19021 2/20 0.39
NAAA Q02083 2/20 0.39
PRSS1 P07477 1/20 0.38
PRSS2 P07478 1/20 0.38
PRSS3 P35030 1/20 0.38
MAPT P10636 2/20 0.38
MAPK1 P28482 1/20 0.38
CNR1 P21554 3/20 0.37
CNR2 P34972 3/20 0.37
TSHR P16473 1/20 0.37
ALDH1A1 P00352 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL443589 0.95 DGKA (0.43) DGKALMNADNM1PAMNAAA
SCHEMBL19468579 0.91 DGKA (0.42) DGKALMNADNM1PAMNAAA
SCHEMBL9790274 0.91 DGKA (0.49) DGKALMNADNM1PAMNAAA
SCHEMBL15282761 0.91 DGKA (0.49) DGKALMNADNM1PAMNAAA
SCHEMBL1507928 0.91 DGKA (0.49) DGKALMNADNM1PAMNAAA
SCHEMBL1191808 0.91 DGKA (0.49) DGKALMNADNM1PAMNAAA
SCHEMBL1191042 0.91 DGKA (0.49) DGKALMNADNM1PAMNAAA
SCHEMBL9616578 0.91 DGKA (0.49) DGKALMNADNM1PAMNAAA
SCHEMBL574866 0.86 DGKA (0.46) DGKALMNADNM1PAMNAAA
SCHEMBL3637134 0.85 DGKA (0.57) DGKALMNADNM1PAMMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3124535-B1 USE OF A COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE ZEON CORP (JP) 2021-03-17 EP disclosed
US-10414908-B2 Composition for dip molding and dip-molded article ZEON CORPORATION (JP) 2019-09-17 US disclosed
US-20170088700-A1 COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE ZEON CORPORATION (JP) 2017-03-30 US disclosed
EP-3124535-A1 COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE Zeon Corporation (JP) 2017-02-01 EP disclosed
US-20090278284-A1 PROCESS FOR MAKING A DIP-FORMING COMPOSITION AND A DIP-FORMED ARTICLE KODAMA KAZUMI 2009-11-12 US disclosed
US-20080051498-A1 Dip-Forming Composition and Dip-Formed Article ZEON CORPORATION (JP) 2008-02-28 US disclosed
EP-1826236-A1 COMPOSITION FOR DIP FORMING AND DIP-FORMED MOLDING ZEON CORPORATION (JP) 2007-08-29 EP disclosed