SCHEMBL4358089

SCHEMBL4358089

CC(C)n1ncc(C#N)c1Cl

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDK2 P24941 2/20 0.40
DRD4 P21917 1/20 0.34
RXRA P19793 1/20 0.33
RXRB P28702 1/20 0.33
RXRG P48443 1/20 0.33
KDM4E B2RXH2 4/20 0.33
ALDH1A1 P00352 3/20 0.33
TDP1 Q9NUW8 1/20 0.33
MAPT P10636 1/20 0.33
CSNK1A1 P48729 1/20 0.32
CLK4 Q9HAZ1 1/20 0.32
NPBWR1 P48145 1/20 0.32
MCHR1 Q99705 1/20 0.32
POLB P06746 3/20 0.31
LMNA P02545 1/20 0.31
RXFP1 Q9HBX9 1/20 0.31
MAOA P21397 1/20 0.31
MAOB P27338 1/20 0.31
PTGS1 P23219 1/20 0.31
PTGS2 P35354 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4351354 0.78 KDM5A (0.36) CDK2DRD4RXRARXRBRXRG
SCHEMBL4360410 0.77 CDK2 (0.37) CDK2KDM4EALDH1A1MAPTCLK4
SCHEMBL55228 0.77 KDM4E (0.44) CDK2KDM4EALDH1A1POLBLMNA
SCHEMBL11967314 0.77 MAPT (0.36) CDK2KDM4EALDH1A1MAPTNPBWR1
SCHEMBL12689106 0.77 CDK2 (0.34) CDK2KDM4EALDH1A1MAPTPOLB
SCHEMBL25291001 0.77 CDK2 (0.34) CDK2RXRARXRBRXRGKDM4E
SCHEMBL25791519 0.74 CDK2 (0.33) CDK2MAPTKDM5A
SCHEMBL4520111 0.74
SCHEMBL4347184 0.73 DRD4 (0.35) DRD4KDM4EPOLB
SCHEMBL22363283 0.71 DRD4 (0.37) DRD4POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed