SCHEMBL4360410

SCHEMBL4360410

CC(C)n1ncc(C#N)c1O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDK2 P24941 2/20 0.37
PIK3CD O00329 1/20 0.33
ABL1 P00519 1/20 0.33
EGFR P00533 1/20 0.33
HCK P08631 1/20 0.33
SRC P12931 1/20 0.33
KDR P35968 1/20 0.33
PIK3CA P42336 1/20 0.33
PIK3CB P42338 1/20 0.33
MTOR P42345 1/20 0.33
PIK3CG P48736 1/20 0.33
EPHB4 P54760 1/20 0.33
PRKDC P78527 1/20 0.33
KDM4E B2RXH2 8/20 0.33
ALDH1A1 P00352 5/20 0.33
HPGD P15428 3/20 0.33
HSD17B10 Q99714 2/20 0.33
MAPT P10636 1/20 0.33
CSNK2A1 P68400 2/20 0.32
KDM5A P29375 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4351354 0.78 KDM5A (0.36) CDK2KDM4EALDH1A1HPGDHSD17B10
SCHEMBL12689106 0.77 CDK2 (0.34) CDK2KDM4EALDH1A1HPGDMAPT
SCHEMBL11967314 0.77 MAPT (0.36) CDK2KDM4EALDH1A1HPGDMAPT
SCHEMBL55228 0.77 KDM4E (0.44) CDK2PIK3CDABL1EGFRHCK
SCHEMBL4358089 0.77 CDK2 (0.40) CDK2KDM4EALDH1A1HPGDMAPT
SCHEMBL25291001 0.77 CDK2 (0.34) CDK2ABL1KDRKDM4EALDH1A1
SCHEMBL25791519 0.74 CDK2 (0.33) CDK2MAPTKDM5AKDM4C
SCHEMBL4349408 0.74
SCHEMBL4353034 0.72 POLB (0.37) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL23399096 0.71 DRD4 (0.35) KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed