⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL435521 | 0.92 | — | — | |
| SCHEMBL434894 | 0.90 | — | — | |
| SCHEMBL437922 | 0.83 | — | — | |
| SCHEMBL5927827 | 0.83 | — | — | |
| SCHEMBL6139435 | 0.83 | — | — | |
| SCHEMBL5611758 | 0.83 | — | — | |
| SCHEMBL5858055 | 0.80 | — | — | |
| SCHEMBL6326957 | 0.80 | — | — | |
| SCHEMBL5611533 | 0.80 | — | — | |
| SCHEMBL5612519 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 91 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11319410-B2 | Precursor for polyimide and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2022-05-03 | — | — | US | claimed |
| CN-108192098-B | Polyimide precursor composition and use thereof | 长兴材料工业股份有限公司 | 2021-06-15 | — | — | CN | claimed |
| CN-107189067-B | Polyimide precursor and application thereof | 长兴材料工业股份有限公司 | 2021-01-05 | — | — | CN | claimed |
| US-10731004-B2 | Polyimide precursor composition and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2020-08-04 | — | — | US | claimed |
| US-10626220-B2 | Precursor for polyimide and use thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2020-04-21 | — | — | US | claimed |
| CN-107312173-B | polyimide precursor and use thereof | 长兴材料工业股份有限公司 | 2019-12-17 | — | — | CN | claimed |
| US-20180194899-A1 | PRECURSOR FOR POLYIMIDE AND USE THEREOF | ETERNAL MATERIALS CO., LTD. (TW) | 2018-07-12 | — | — | US | claimed |
| US-20180148544-A1 | PRECURSOR FOR POLYIMIDE AND USE THEREOF | ETERNAL MATERIAL CO., LTD. (TW) | 2018-05-31 | — | — | US | claimed |
| US-20180148541-A1 | POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | ETERNAL MATERIALS CO., LTD. (TW) | 2018-05-31 | — | — | US | claimed |
| US-9334369-B2 | Polyimide precursor composition and preparation method and use thereof | ETERNAL CHEMICAL CO., LTD. (TW) | 2016-05-10 | — | — | US | claimed |
| US-8735534-B2 | Precursor composition for polyimide and use thereof | ETERNAL CHEMICAL CO., LTD. (TW) | 2014-05-27 | — | — | US | claimed |
| US-20130172494-A1 | POLYIMIDE PRECURSOR COMPOSITION AND PREPARATION METHOD AND USE THEREOF | ETERNAL CHEMICAL CO., LTD. (TW) | 2013-07-04 | — | — | US | claimed |
| US-8101703-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD (TW) | 2012-01-24 | — | — | US | claimed |
| US-20100297455-A1 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE | ETERNAL CHEMICAL CO., LTD. | 2010-11-25 | — | — | US | claimed |
| US-7790828-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. (CN) | 2010-09-07 | — | — | US | claimed |
| US-20100168265-A1 | PRECURSOR COMPOSITION FOR POLYIMIDE AND USE THEREOF | ETERNAL CHEMICAL CO., LTD. (TW) | 2010-07-01 | — | — | US | claimed |
| US-20080096997-A1 | Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses | ETERNAL MATERIALS CO., LTD. (TW) | 2008-04-24 | — | — | US | claimed |
| US-20050245715-A1 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. | 2005-11-03 | — | — | US | claimed |
| CN-116954023-A | Negative photosensitive resin composition, cured film, and pattern cured film | 武汉柔显科技股份有限公司 | 2023-10-27 | — | — | CN | disclosed |
| EP-0206251-B1 | HALOACETAMIDE COMPOUNDS, PROCESS FOR PRODUCTION THEREOF, AND USE THEREOF AS HERBICIDE | TOKUYAMA SODA KABUSHIKI KAISHA (JP) | 1988-09-07 | — | — | EP | disclosed |