⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5858055 | 1.00 | — | — | |
| SCHEMBL6326957 | 1.00 | — | — | |
| SCHEMBL5611758 | 0.97 | — | — | |
| SCHEMBL6139435 | 0.97 | — | — | |
| SCHEMBL5927827 | 0.90 | — | — | |
| SCHEMBL7906180 | 0.89 | THRB (0.40) | — | |
| SCHEMBL7912907 | 0.89 | THRB (0.40) | — | |
| SCHEMBL8945719 | 0.89 | THRB (0.40) | — | |
| SCHEMBL7906182 | 0.89 | THRB (0.40) | — | |
| SCHEMBL7909301 | 0.89 | THRB (0.40) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6916890-B1 | Thermally reworkable epoxy resins and compositions based thereon | HENKEL CORPORATION (US) | 2005-07-12 | — | — | US | claimed |
| US-5486545-A | SOLVENT RESISTANCE | RENSSELAER POLYTECHNIC INSTITUTE (US) | 1996-01-23 | — | — | US | claimed |
| CN-120005519-A | Curable composition for organic EL element sealing agent, cured film, organic EL element, and method for producing same | JSR株式会社 | 2025-05-16 | — | — | CN | disclosed |
| US-7271219-B2 | Useful as overcoating materials and interlayer insulating materials for wiring boards | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-09-18 | — | — | US | disclosed |
| US-7009009-B1 | Fluxing underfill compositions | HENKEL CORPORATION (US) | 2006-03-07 | — | — | US | disclosed |
| US-6916890-B1 | Thermally reworkable epoxy resins and compositions based thereon | HENKEL CORPORATION (US) | 2005-07-12 | — | — | US | disclosed |
| US-20040102601-A1 | Useful as overcoating materials and interlayer insulating materials for wiring boards | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-05-27 | — | — | US | disclosed |
| EP-1375553-A1 | CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-6667194-B1 | Method of bonding die chip with underfill fluxing composition | HENKEL LOCTITE CORPORATION | 2003-12-23 | — | — | US | disclosed |
| US-5486545-A | SOLVENT RESISTANCE | RENSSELAER POLYTECHNIC INSTITUTE (US) | 1996-01-23 | — | — | US | disclosed |