⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8429545 | 0.67 | — | — | |
| SCHEMBL12796553 | 0.53 | — | — | |
| SCHEMBL2783664 | 0.50 | — | — | |
| SCHEMBL19773759 | 0.50 | — | — | |
| SCHEMBL5206262 | 0.48 | — | — | |
| SCHEMBL16884729 | 0.47 | — | — | |
| SCHEMBL1024758 | 0.47 | — | — | |
| SCHEMBL22698345 | 0.45 | — | — | |
| SCHEMBL104379 | 0.45 | — | — | |
| SCHEMBL2040572 | 0.44 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106604943-B | Copolymer comprising oxazoline monomer and its purposes as crosslinking agent | 巴斯夫欧洲公司 | 2019-10-08 | — | — | CN | claimed |
| CN-106604943-A | Copolymer containing oxazoline monomers and use thereof as cross-linking agent | 巴斯夫欧洲公司 | 2017-04-26 | — | — | CN | claimed |
| US-7575150-B2 | Flux composition for solder, solder paste, and method of soldering | NOF CORPORATION (JP) | 2009-08-18 | — | — | US | disclosed |
| US-20080073414-A1 | FLUX COMPOSITION FOR SOLDER, SOLDER PASTE, AND METHOD OF SOLDERING | NOF CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| EP-1439025-B1 | FLUX COMPOSITION FOR SOLDER, SOLDER PASTE AND METHOD OF SOLDERING | NOF CORP (JP) | 2006-11-02 | — | — | EP | disclosed |
| US-20040250919-A1 | Flux composition for solder, solder paste, and method of soldering | NOF CORPORATION (JP) | 2004-12-16 | — | — | US | disclosed |
| EP-1439025-A1 | FLUX COMPOSITION FOR SOLDER&comma; SOLDER PASTE&comma; AND METHOD OF SOLDERING | NOF CORPORATION (JP) | 2004-07-21 | — | — | EP | disclosed |