SCHEMBL436233

SCHEMBL436233

Nc1ccc([Si](c2ccccc2)(c2ccccc2)c2ccc(N)cc2)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.53
CYP3A4 P08684 4/20 0.50
TDP1 Q9NUW8 3/20 0.50
HSD17B10 Q99714 2/20 0.50
TAAR1 Q96RJ0 1/20 0.50
MAPT P10636 9/20 0.44
MEN1 O00255 5/20 0.44
KMT2A Q03164 5/20 0.44
MAOB P27338 6/20 0.44
MAOA P21397 5/20 0.44
ALDH1A1 P00352 5/20 0.44
RAB9A P51151 5/20 0.44
L3MBTL1 Q9Y468 3/20 0.44
CYP1A2 P05177 2/20 0.44
CYP2C9 P11712 2/20 0.44
CYP2C19 P33261 2/20 0.44
HTT P42858 2/20 0.44
KDM4E B2RXH2 2/20 0.44
CYP2D6 P10635 1/20 0.44
PKM P14618 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17118421 1.00 TSHR (0.53) TSHRCYP3A4TDP1HSD17B10TAAR1
SCHEMBL23661322 1.00 TSHR (0.53) TSHRCYP3A4TDP1HSD17B10TAAR1
Benzidine SCHEMBL9634896 0.93 CYP3A4 (0.64) TSHRCYP3A4TDP1HSD17B10TAAR1
SCHEMBL17657680 0.93 CYP3A4 (0.64) TSHRCYP3A4TDP1HSD17B10TAAR1
SCHEMBL23661031 0.89 ACHE (0.56) TSHRCYP3A4TDP1HSD17B10TAAR1
SCHEMBL2119390 0.88 MEN1 (0.57) TSHRCYP3A4TDP1HSD17B10TAAR1
SCHEMBL126319 0.85 ESR1 (0.43) TSHRTDP1HSD17B10MAPTMEN1
SCHEMBL15975758 0.85 ESR1 (0.43) TSHRTDP1HSD17B10MAPTMEN1
SCHEMBL103830 0.85 ESR1 (0.43) TSHRTDP1HSD17B10MAPTMEN1
SCHEMBL12879524 0.85 ESR1 (0.43) TSHRTDP1HSD17B10MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 426 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105315666-B Transparent polymer film, electronic device including the same, and composition 三星电子株式会社 2020-03-10 CN claimed
CN-106009664-B Compositions, composites prepared therefrom, and films and electronic devices including the same 三星电子株式会社 2020-02-04 CN claimed
US-9975997-B2 Compositions, composites prepared therefrom, and films and electronic devices including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-05-22 US claimed
US-20160280857-A1 COMPOSITIONS, COMPOSITES PREPARED THEREFROM, AND FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-09-29 US claimed
US-20160009862-A1 TRANSPARENT POLYMER FILM AND ELECTRONIC DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-01-14 US claimed
US-20070009751-A1 Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom CHANG CHUN PLASTICS CO., LTD. (TW) 2007-01-11 US claimed
US-7005163-B2 Organic-inorganic hybrid film material and its fabrication CHANG CHUN PLASTICS CO., LTD. (TW) 2006-02-28 US claimed
EP-1000108-B1 AQUEOUS POLYIMIDE PROCESS COMMW SCIENT IND RES ORG (AU) 2005-01-05 EP claimed
US-20040110014-A1 Organic-inorganic hybrid film material and its fabrication CHANG CHUN PLASTICS CO., LTD. (TW) 2004-06-10 US claimed
US-6333391-B1 FROM AMINES AND CARBOXYLIC ACIDS OR ANHYDRIDES, IN WATER; COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION (AU) 2001-12-25 US claimed
EP-1000108-A4 AQUEOUS POLYIMIDE PROCESS COMMW SCIENT IND RES ORG (AU) 2000-10-11 EP claimed
EP-1000108-A1 AQUEOUS POLYIMIDE PROCESS COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION (AU) 2000-05-17 EP claimed
WO-1999006470-A1 AQUEOUS POLYIMIDE PROCESS COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION (AU) 1999-02-11 WO claimed
US-5136015-A Reacting an unsaturated bisimide and a lesser stoichiometric amount of diamine followed by a polyamine having 3 or more benzene rings MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1992-08-04 US claimed
EP-0317943-A2 Polymers prepared from 4,4'-bis-[2-(3,4-(dicarboxyphenyl) hexafluoroisopropyl] diphenyl ether dianhydride HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
EP-0311078-A1 Heat resistant resin composition MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1989-04-12 EP claimed
US-RE29316-E FROM UNSATURATED BIS-IMIDE AND A DI-PRIMARY DIAMINE RHONE-POULENC S.A. (FR) 1977-07-19 US claimed
EP-3425431-B1 LAMINATED FILM, AND DISPLAY DEVICE INCLUDING SAME SAMSUNG ELECTRONICS CO LTD (KR) 2025-10-01 EP disclosed
US-3957726-A S-TRIAZINE-IMIDE COPOLYMERS CIBA-GEIGY CORPORATION (US) 1976-05-18 US disclosed
US-3954710-A Polymers prepared from imide containing dianhydrides WESTINGHOUSE ELECTRIC CORPORATION (US) 1976-05-04 US disclosed