Methylamine

Methylamine

SCHEMBL4367430

C=CC(=O)OCCC.CN

nearest known ligand 0.69

Full drug profile on Sugi Atlas →

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.69
HPGD P15428 1/20 0.69
ALDH1A1 P00352 5/20 0.58
TP53 P04637 3/20 0.58
HIF1A Q16665 3/20 0.58
CYP3A4 P08684 2/20 0.58
HSD17B10 Q99714 1/20 0.58
HCAR2 Q8TDS4 4/20 0.52
THRB P10828 3/20 0.52
ATM Q13315 1/20 0.45
MAPK1 P28482 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
MAPT P10636 1/20 0.38
RAB9A P51151 1/20 0.38
NPSR1 Q6W5P4 1/20 0.38
APP P05067 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methylamine SCHEMBL28257768 0.98 TSHR (0.67) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL14982 0.95
SCHEMBL30074662 0.95 TSHR (0.75) TSHRHPGDALDH1A1TP53HIF1A
Ethylamine SCHEMBL4372163 0.93 TSHR (0.67) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL2546168 0.93
Hydrogen Sulfide SCHEMBL12537994 0.93
Ethylene SCHEMBL7197435 0.93 TSHR (0.72) TSHRHPGDALDH1A1TP53HIF1A
Hydrochloric Acid SCHEMBL15846411 0.93
Ammonia Solution, Strong SCHEMBL22686891 0.93
SCHEMBL1035378 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US claimed
CN-120019125-A Adhesive film, optical member including the same, and optical display device including the same 三星SDI株式会社 2025-05-16 CN disclosed
CN-110172156-A A kind of composite nanoparticle and the preparation method and application thereof containing conjugated polymer 华中科技大学 2019-08-27 CN disclosed
CN-108524354-A Skin care compositions, facial treatment mask and preparation method thereof 广州抓猫电子商务有限公司 2018-09-14 CN disclosed
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US disclosed
CN-101738888-A Developer, developer storing body, developing device and image forming apparatus OKI DATA KK 2010-06-16 CN disclosed
US-20090047786-A1 CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method RESONAC CORPORATION (JP) 2009-02-19 US disclosed
US-20070072124-A1 Optical recording composition, production method thereof and optical recording medium FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed
CN-1073137-C curable resin composition for water-based paint DAINIPPON INK & CHEMICALS (JP) 2001-10-17 CN disclosed
CN-1178546-A Curable resin composition for water-based paints DAINIPPON INK & CHEMICALS (JP) 1998-04-08 CN disclosed