Ethylamine

Ethylamine

SCHEMBL4372163

C=CC(=O)OCCC.CCN

nearest known ligand 0.67

Full drug profile on Sugi Atlas →

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.67
HPGD P15428 1/20 0.67
ALDH1A1 P00352 4/20 0.56
TP53 P04637 3/20 0.56
HIF1A Q16665 3/20 0.56
CYP3A4 P08684 2/20 0.56
HSD17B10 Q99714 1/20 0.56
HCAR2 Q8TDS4 4/20 0.50
THRB P10828 3/20 0.50
ATM Q13315 1/20 0.43
MAPK1 P28482 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
MAPT P10636 1/20 0.37
RAB9A P51151 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
APP P05067 1/20 0.37
ALOX5 P09917 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propylamine SCHEMBL3281793 0.94 TSHR (0.64) TSHRHPGDALDH1A1TP53HIF1A
Methylamine SCHEMBL4367430 0.93 TSHR (0.69) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL30074662 0.93 TSHR (0.75) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL14982 0.93
Allylamine SCHEMBL28296730 0.92 TSHR (0.62) TSHRHPGDALDH1A1TP53HIF1A
Methylamine SCHEMBL28257768 0.91 TSHR (0.67) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL2546168 0.91
Ethylene SCHEMBL7197435 0.91 TSHR (0.72) TSHRHPGDALDH1A1TP53HIF1A
Hydrochloric Acid SCHEMBL15846411 0.91
Ammonia Solution, Strong SCHEMBL22686891 0.91

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US claimed
CN-120019125-A Adhesive film, optical member including the same, and optical display device including the same 三星SDI株式会社 2025-05-16 CN disclosed
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US disclosed
US-20090047786-A1 CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method RESONAC CORPORATION (JP) 2009-02-19 US disclosed