⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL437530 | 1.00 | — | — | |
| SCHEMBL31005885 | 0.91 | — | — | |
| SCHEMBL436478 | 0.88 | — | — | |
| SCHEMBL436480 | 0.88 | — | — | |
| SCHEMBL28973639 | 0.86 | — | — | |
| SCHEMBL433189 | 0.84 | — | — | |
| SCHEMBL434909 | 0.84 | — | — | |
| SCHEMBL434908 | 0.84 | — | — | |
| SCHEMBL433188 | 0.84 | — | — | |
| SCHEMBL437255 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115851117-A | Resin composition for coating and coating film containing cured product thereof as coating layer | 可隆工业株式会社 | 2023-03-28 | — | — | CN | claimed |
| US-8101703-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD (TW) | 2012-01-24 | — | — | US | claimed |
| US-20100297455-A1 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE | ETERNAL CHEMICAL CO., LTD. | 2010-11-25 | — | — | US | claimed |
| US-7790828-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. (CN) | 2010-09-07 | — | — | US | claimed |
| US-20050245715-A1 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. | 2005-11-03 | — | — | US | claimed |
| CN-113260922-B | Positive photosensitive resin composition | 株式会社东进世美肯 | 2025-02-25 | — | — | CN | disclosed |
| CN-113906106-B | Thermally conductive composition package and 2-liquid curable thermally conductive composition | 积水保力马科技株式会社 | 2023-08-22 | — | — | CN | disclosed |
| US-8101703-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD (TW) | 2012-01-24 | — | — | US | disclosed |
| US-20100297455-A1 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE | ETERNAL CHEMICAL CO., LTD. | 2010-11-25 | — | — | US | disclosed |
| US-7790828-B2 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. (CN) | 2010-09-07 | — | — | US | disclosed |
| US-20050245715-A1 | Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage | ETERNAL CHEMICAL CO., LTD. | 2005-11-03 | — | — | US | disclosed |