SCHEMBL437255

SCHEMBL437255

CCC=COCCC[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL435854 0.94
SCHEMBL436473 0.88
SCHEMBL436616 0.85
SCHEMBL437679 0.85
SCHEMBL437530 0.82
SCHEMBL437531 0.82
SCHEMBL436036 0.82 LMNA (0.35)
SCHEMBL434717 0.79
SCHEMBL434683 0.79
SCHEMBL436510 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8101703-B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD (TW) 2012-01-24 US claimed
US-20100297455-A1 PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE ETERNAL CHEMICAL CO., LTD. 2010-11-25 US claimed
US-7790828-B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. (CN) 2010-09-07 US claimed
US-20050245715-A1 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. 2005-11-03 US claimed
CN-113906106-B Thermally conductive composition package and 2-liquid curable thermally conductive composition 积水保力马科技株式会社 2023-08-22 CN disclosed
US-8101703-B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD (TW) 2012-01-24 US disclosed
US-20100297455-A1 PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE ETERNAL CHEMICAL CO., LTD. 2010-11-25 US disclosed
US-7790828-B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. (CN) 2010-09-07 US disclosed
US-20050245715-A1 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage ETERNAL CHEMICAL CO., LTD. 2005-11-03 US disclosed
EP-0396130-B1 Alkenyloxy-functional organosilicon compounds, their preparation and use WACKER CHEMIE GMBH (DE) 1996-09-18 EP disclosed
US-5118772-A Crosslinkable with UV radiation; coatings WACKER-CHEMIE GMBH (DE) 1992-06-02 US disclosed
US-5057549-A ALKENYLOXY-FUNCTIONAL ORGANOSILICON COMPOUNDS, THEIR PREPARATION AND USE WACKER-CHEMIE GMBH (DE) 1991-10-15 US disclosed
EP-0396130-A2 Alkenyloxy-functional organosilicon compounds, their preparation and use WACKER-CHEMIE GMBH (DE) 1990-11-07 EP disclosed