Ethylamine

Ethylamine

SCHEMBL4375411

C=C(C)C(=O)OCCC.CCN

nearest known ligand 0.62

Full drug profile on Sugi Atlas →

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.62
THRB P10828 1/20 0.59
ALDH1A1 P00352 6/20 0.41
TDP1 Q9NUW8 3/20 0.39
POLB P06746 1/20 0.39
APEX1 P27695 1/20 0.39
HTT P42858 1/20 0.39
HCAR2 Q8TDS4 1/20 0.36
GAA P10253 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
LMNA P02545 2/20 0.34
ESR1 P03372 1/20 0.33
CHRM1 P11229 1/20 0.33
SLC6A2 P23975 1/20 0.33
KDR P35968 1/20 0.33
HPGD P15428 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylenediamine SCHEMBL4651025 0.96 TSHR (0.62) TSHRTHRBALDH1A1TDP1POLB
Propylamine SCHEMBL3282032 0.94 TSHR (0.60) TSHRTHRBALDH1A1TDP1POLB
Methylamine SCHEMBL4365692 0.93 TSHR (0.64) TSHRTHRBALDH1A1TDP1POLB
SCHEMBL21772349 0.93 TSHR (0.69) TSHRTHRBALDH1A1TDP1POLB
SCHEMBL16573 0.93
SCHEMBL7521412 0.91 TSHR (0.62) TSHRTHRBALDH1A1TDP1POLB
Acetamide SCHEMBL6358408 0.91 TSHR (0.62) TSHRTHRBALDH1A1TDP1POLB
SCHEMBL6879356 0.91 TSHR (0.67) TSHRTHRBALDH1A1TDP1POLB
Hydrogen Sulfide SCHEMBL6879353 0.91 TSHR (0.67) TSHRTHRBALDH1A1TDP1POLB
SCHEMBL1514196 0.91 TSHR (0.67) TSHRTHRBALDH1A1TDP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US claimed
US-8524111-B2 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-09-03 US disclosed
US-20090047786-A1 CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method RESONAC CORPORATION (JP) 2009-02-19 US disclosed
CN-101273292-A Polarizing plate with optical compensation layer, liquid crystal panel using polarizing plate with optical compensation layer, and image display device NITTO DENKO CORP (JP) 2008-09-24 CN disclosed
CN-101258432-A Polarizing plate with optical compensation layer, liquid crystal panel using polarizing plate with optical compensation layer, and image display unit NITTO DENKO CORP (JP) 2008-09-03 CN disclosed
CN-101253431-A Polarizer protective film, polarizing plate and image display NITTO DENKO CORP (JP) 2008-08-27 CN disclosed
US-20080124552-A1 Particle With Rough Surface For Plating Or Vapor Deposition NISSHINBO INDUSTRIES, INC. (JP) 2008-05-29 US disclosed
US-20080020207-A1 Particle With Rough Surface And Process For Producing The Same NISSHINBO INDUSTRIES, INC. (JP) 2008-01-24 US disclosed
US-20060188577-A1 Element having bioactive substance fixed thereto NISSHINBO INDUSTRIES, INC. (JP) 2006-08-24 US disclosed
EP-1617219-A1 ELEMENT HAVING BIOACTIVE SUBSTANCE FIXED THERETO Nisshinbo Industries, Inc. (JP) 2006-01-18 EP disclosed