Fluoride Ion

Fluoride Ion

SCHEMBL4380671

[F-].[F-].[O+2]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride Ion SCHEMBL6516716 1.00
Fluoride Ion SCHEMBL10401035 0.82 CA4 (0.33)
Fluoride Ion SCHEMBL31482530 0.82
Methane SCHEMBL6939343 0.82
SCHEMBL27427293 0.71
SCHEMBL29468028 0.71
SCHEMBL1652932 0.71
Fluoride Ion SCHEMBL22981870 0.50
Fluoride Ion SCHEMBL552564 0.50
Fluoride Ion SCHEMBL7640529 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119507041-A Method for vertically and directionally growing KTF crystal 福州晶至光电科技有限公司 2025-02-25 CN claimed
CN-107738434-A Flaorination process on a kind of hollow container line 江苏龙灯博士摩包装材料有限公司 2018-02-27 CN claimed
CN-108473398-A Process for producing trans-1-chloro-3, 3, 3-trifluoropropene 中央硝子株式会社 2018-08-31 CN disclosed
CN-107738434-A Flaorination process on a kind of hollow container line 江苏龙灯博士摩包装材料有限公司 2018-02-27 CN disclosed
US-9855725-B2 Vacuum heat insulator and testing method for the glass fiber laminate to be used in the insulator PANASONIC CORPORATION (JP) 2018-01-02 US disclosed
CN-106178996-A A kind of super-hydrophobic nano particle polyamide nano complex reverse osmosis membrane and preparation method thereof 中国科学院城市环境研究所 2016-12-07 CN disclosed
CN-103874742-B Carbazolocarbazole-bis (dicarboximides) and their use as semiconductors 巴斯夫欧洲公司 2016-08-17 CN disclosed
CN-105624725-A Preparation process for perfluorooctyl sulfonyl fluoride TIME CHEMICAL CO LTD 2016-06-01 CN disclosed
CN-100583406-C Method for forming bonding pad opening WINBOND ELECTRONICS CORP 2010-01-20 CN disclosed
CN-101465303-A Method for forming bonding pad opening WINBOND ELECTRONICS CORP (CN) 2009-06-24 CN disclosed
US-20090029095-A1 Vaccum Heat Insulator and Testing Method for the Glass Fiber Laminated to be Used in the Inslulator MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2009-01-29 US disclosed
EP-1884704-A1 VACUUM HEAT INSULATOR AND TESTING METHOD FOR THE GLASS FIBER LAMINATE TO BE USED IN THE INSULATOR MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2008-02-06 EP disclosed
US-6667509-B1 Method of forming sharp beak of poly by oxygen/fluorine implant to improve erase speed for split-gate flash TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2003-12-23 US disclosed
US-6093607-A Method of forming sharp beak of poly by oxygen/fluorine implant to improve erase speed for split-gate flash TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2000-07-25 US disclosed
US-5427638-A Low temperature reaction bonding ALLIEDSIGNAL INC. (US) 1995-06-27 US disclosed
EP-0608537-A1 Discs for memory storage devices Corning Incorporated (US) 1994-08-03 EP disclosed
US-5273834-A Glass-based substrate including a low percentage of oxides of cobalt, iron or nickel CORNING INCORPORATED (US) 1993-12-28 US disclosed