SCHEMBL4391609

SCHEMBL4391609

CC1=CC(=O)N(c2ccc(Oc3ccc(N4C(=O)C=C(C)C4=O)cc3)cc2)C1=O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 4/20 0.49
ALDH1A1 P00352 3/20 0.40
LMNA P02545 3/20 0.40
KMT2A Q03164 5/20 0.39
MEN1 O00255 4/20 0.39
KDM4E B2RXH2 1/20 0.38
POLB P06746 1/20 0.38
F2 P00734 1/20 0.36
ELANE P08246 1/20 0.36
CTSG P08311 1/20 0.36
CMA1 P23946 1/20 0.36
CTRC Q99895 1/20 0.36
HSP90AA1 P07900 1/20 0.36
PKM P14618 1/20 0.36
HPGD P15428 1/20 0.36
HTT P42858 1/20 0.36
CCR6 P51684 1/20 0.36
ATM Q13315 1/20 0.36
BRD4 O60885 1/20 0.36
FAAH O00519 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24208309 0.91 BRD4 (0.49) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL1116234 0.89 MGLL (0.41) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL94147 0.88 MGLL (0.46) MGLLKMT2AMEN1F2ELANE
SCHEMBL1115938 0.85 MGLL (0.38) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL24208358 0.85 MGLL (0.59) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL24208248 0.84 MGLL (0.50) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL8142750 0.82 MGLL (0.57) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL9470447 0.82 GLA (0.58) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL24208354 0.81 MGLL (0.47) MGLLALDH1A1LMNAKMT2AMEN1
SCHEMBL4839640 0.81 MGLL (0.61) MGLLALDH1A1LMNAHSP90AA1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240043636-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2024-02-08 US disclosed
US-20240010805-A1 BMI RESIN FORMULATION FOR CARBON FIBER REINFORCED COMPOSITE MATERIAL, METHOD FOR MAKING IT AND BMI PREPREG TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2024-01-11 US disclosed
EP-4255968-A1 BMI RESIN FORMULATION FOR CARBON FIBER REINFORCED COMPOSITE MATERIAL, METHOD FOR MAKING IT AND BMI PREPREG Toray Composite Materials America, Inc. (US) 2023-10-11 EP disclosed
EP-4255967-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL Toray Composite Materials America, Inc. (US) 2023-10-11 EP disclosed
WO-2022120049-A1 BMI RESIN FORMULATION FOR CARBON FIBER REINFORCED COMPOSITE MATERIAL, METHOD FOR MAKING IT AND BMI PREPREG TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2022-06-09 WO disclosed
WO-2022120053-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2022-06-09 WO disclosed
US-9824797-B2 Resistive grid elements having a thermosetting polymer GENERAL ELECTRIC COMPANY (US) 2017-11-21 US disclosed
US-20160180990-A1 RESISTIVE GRID ELEMENTS HAVING A THERMOSETTING POLYMER GE GLOBAL SOURCING LLC 2016-06-23 US disclosed
US-7592072-B2 Bismaleimide prepreg systems HEXCEL CORPORATION (US) 2009-09-22 US disclosed
US-20070134480-A1 Bismaleimide prepreg systems HEXCEL CORPORATION (US) 2007-06-14 US disclosed
US-4962161-A BISMALEIMIDE OR POLYMALEIMIDE AND ETHER DERIVATIVE OF ALKENYLPHENOL HERCULES INCORPORATED (US) 1990-10-09 US disclosed
US-4874828-A AEROSPACE HERCULES INCORPORATED (US) 1989-10-17 US disclosed
US-4849485-A Heterocyclic styryl compounds and reaction products THE DOW CHEMICAL COMPANY (US) 1989-07-18 US disclosed
EP-0318868-A1 Maleimide-based thermosettable resin compositions HERCULES INCORPORATED (US) 1989-06-07 EP disclosed
EP-0313863-A2 Heat resistant thermosetting phosphazene-imide copolymers HERCULES INCORPORATED (US) 1989-05-03 EP disclosed
EP-0304009-A1 Thermosettable resin compositions HERCULES INCORPORATED (US) 1989-02-22 EP disclosed
US-4736035-A Heterocyclic styryl compounds and resins prepared therefrom THE DOW CHEMICAL COMPANY (US) 1988-04-05 US disclosed
US-4500690-A Thermosetting polymers from aromatic aldehydes, azines and isopropenyl phenols THE DOW CHEMICAL COMPANY (US) 1985-02-19 US disclosed
US-4323662-A Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1982-04-06 US disclosed
US-4298720-A HEAT RESISTANT MOLDING MATERIALS AND VULCANIZATION ACCELERATORS MITSUI TOATSU CHEMICALS INCORPORATED (JP) 1981-11-03 US disclosed