Phenol

Phenol

SCHEMBL439600

C1=CCC=C1.Oc1ccccc1

nearest known ligand 0.61

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 3/20 0.61
CA2 P00918 3/20 0.61
CA9 Q16790 3/20 0.61
CA14 Q9ULX7 3/20 0.61
CA1 P00915 2/20 0.61
CA3 P07451 2/20 0.61
CA4 P22748 2/20 0.61
TDP1 Q9NUW8 2/20 0.61
GLA P06280 1/20 0.61
MMP3 P08254 1/20 0.43
BCL2L1 Q07817 1/20 0.43
ESR1 P03372 9/20 0.39
ESR2 Q92731 9/20 0.39
KMT2A Q03164 3/20 0.39
MEN1 O00255 2/20 0.39
NPC1 O15118 2/20 0.39
LTA4H P09960 1/20 0.39
NR1H2 P55055 1/20 0.39
BAX Q07812 1/20 0.39
LMNA P02545 3/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL28314839 1.00 CA12 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL21247773 1.00 CA12 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL28222830 1.00 CA12 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL467400 1.00 CA12 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL49522 1.00 CA12 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL28187398 1.00 CA12 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL20377183 0.97 CA12 (0.58) CA12CA2CA9CA14CA1
Phenol SCHEMBL27549923 0.97 CA12 (0.58) CA12CA2CA9CA14CA1
Phenol SCHEMBL20377182 0.97 CA12 (0.58) CA12CA2CA9CA14CA1
Phenol SCHEMBL16632336 0.93 TDP1 (0.52) CA12CA2CA9CA14CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 499 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117946494-A Epoxy plastic packaging material for packaging discrete devices and application thereof 江苏中科科化新材料股份有限公司 2024-04-30 CN claimed
CN-115322278-A Sulfonated nitrostyrene resin and preparation method and application thereof 杭摩科技新材料(阜阳)有限公司 2022-11-11 CN claimed
CN-109306039-A A kind of compositions of thermosetting resin, prepreg, metal-clad laminate and the high-frequency circuit board made by it 广东生益科技股份有限公司 2019-02-05 CN claimed
CN-109306040-A A kind of compositions of thermosetting resin, prepreg, metal-clad laminate and the high-frequency circuit board made by it 广东生益科技股份有限公司 2019-02-05 CN claimed
CN-109306171-A A kind of compositions of thermosetting resin, prepreg, metal-clad laminate and the high-frequency circuit board made by it 广东生益科技股份有限公司 2019-02-05 CN claimed
EP-3354672-A1 PREPARATION AND APPLICATION OF DICYCLOPENTADIENE-PHENOL AND 2,6-DIMETHYL PHENOL COPOLYMER EPOXY RESIN Nan-Ya Plastics Corporation (TW) 2018-08-01 EP claimed
US-20180208710-A1 Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin NAN YA PLASTICS CORPORATION (TW) 2018-07-26 US claimed
CN-102432834-B For the preparation of the oligomeric halogenated chain extenders of epoxy resin DOW GLOBAL TECHNOLOGIES INC. (US) 2015-09-16 CN claimed
CN-102432834-A Oligomeric halogenated chain extenders for the preparation of epoxy resins DOW GLOBAL TECHNOLOGIES INC 2012-05-02 CN claimed
US-20090301762-A1 OLIGOMERIC HALOGENATED CHAIN EXTENDERS FOR PREPARING EPOXY RESINS DOW GLOBAL TECHNOLOGIES INC. (US) 2009-12-10 US claimed
CN-101460538-A Oligomeric halogenated chain extenders for the preparation of epoxy resins DOW GLOBAL TECHNOLOGIES INC (US) 2009-06-17 CN claimed
EP-2029654-A2 OLIGOMERIC HALOGENATED CHAIN EXTENDERS FOR PREPARING EPOXY RESINS Dow Global Technologies Inc. (US) 2009-03-04 EP claimed
US-20080039595-A1 Oligomeric halogenated chain extenders for preparing epoxy resins BLUE CUBE IP LLC 2008-02-14 US claimed
WO-2007145807-A2 OLIGOMERIC HALOGENATED CHAIN EXTENDERS FOR PREPARING EPOXY RESINS DOW GLOBAL TECHNOLOGIES INC. (US) 2007-12-21 WO claimed
US-20070287811-A1 Oligomeric halogenated chain extenders for preparing epoxy resins BLUE CUBE IP LLC 2007-12-13 US claimed
CN-1761714-A Molding compositions containing quaternary organophosphonium salts HENKEL CORP (US) 2006-04-19 CN claimed
JP-9188747-A None JP disclosed
JP-1138037-A None JP disclosed
US-4855385-A Monocarboxylic acid derivatives of aliphatic based epoxy resins THE DOW CHEMICAL COMPANY (US) 1989-08-08 US disclosed
JP-H01138037-A RESIN COMPOSITION FOR SHELL MOLD HITACHI CHEM CO LTD 1989-05-30 JP disclosed