Phenol

Phenol

SCHEMBL16632336

C1=CCC=C1.C1=CCC=C1.C=O.Oc1ccccc1

nearest known ligand 0.52

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.52
CA12 O43570 2/20 0.52
CA1 P00915 2/20 0.52
CA2 P00918 2/20 0.52
CA9 Q16790 2/20 0.52
GLA P06280 1/20 0.52
CA3 P07451 1/20 0.52
CA4 P22748 1/20 0.52
CA14 Q9ULX7 1/20 0.52
MMP3 P08254 1/20 0.39
BCL2L1 Q07817 1/20 0.39
CES2 O00748 1/20 0.38
ESR1 P03372 7/20 0.35
ESR2 Q92731 6/20 0.34
KMT2A Q03164 3/20 0.34
MEN1 O00255 2/20 0.34
LTA4H P09960 1/20 0.34
NR1H2 P55055 1/20 0.34
BAX Q07812 1/20 0.34
NPC1 O15118 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL27386862 1.00 TDP1 (0.52) TDP1CA12CA1CA2CA9
Phenol SCHEMBL439600 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL28314839 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL21247773 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL49522 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL467400 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL28222830 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL28187398 0.93 CA12 (0.61) TDP1CA12CA1CA2CA9
Phenol SCHEMBL28343045 0.92 CA2 (0.44) TDP1CA12CA1CA2CA9
Phenol SCHEMBL20377182 0.90 CA12 (0.58) TDP1CA12CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117986505-A Modified dicyclopentadiene based resins 南亚塑胶工业股份有限公司 2024-05-07 CN claimed
US-20240136454-A1 BACK PANEL OF SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME NAN YA PLASTICS CORPORATION (TW) 2024-04-25 US claimed
CN-115746259-A Low-thermal-expansion-coefficient transparent photocuring modified resin and preparation method thereof 北京高盟新材料股份有限公司 2023-03-07 CN claimed
CN-110845706-B Thermosetting resin composition, prepreg using same, laminated board and printed circuit board 陕西生益科技有限公司 2022-06-24 CN claimed
CN-109306149-B Halogen-containing antimony-free resin composition, prepreg using same, laminated board and printed circuit board 陕西生益科技有限公司 2021-07-20 CN claimed
CN-109233209-B Halogen-containing antimony-free resin composition, prepreg using same, laminated board and printed circuit board 陕西生益科技有限公司 2021-03-30 CN claimed
CN-109354827-B Halogen-containing antimony-free resin composition, prepreg using same, laminated board and printed circuit board 陕西生益科技有限公司 2021-03-05 CN claimed
US-10403865-B2 Aluminum film packaging materials used for lithium batteries NAN YA PLASTICS CORPORATION (TW) 2019-09-03 US claimed
US-20150104698-A1 ALUMINUM FILM PACKAGING MATERIALS USED FOR LITHIUM BATTERIES NAN YA PLASTICS CORPORATION (TW) 2015-04-16 US claimed
CN-1990542-A Halogen-free phosphide-free flame-retardant thermosetting polymer material composition IND TECH RES INST (CN) 2007-07-04 CN claimed
CN-117986505-A Modified dicyclopentadiene based resins 南亚塑胶工业股份有限公司 2024-05-07 CN disclosed
CN-117986416-A Modified dicyclopentadiene resin and preparation method thereof 南亚塑胶工业股份有限公司 2024-05-07 CN disclosed
US-20240136454-A1 BACK PANEL OF SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME NAN YA PLASTICS CORPORATION (TW) 2024-04-25 US disclosed
CN-117855306-A Back sheet of solar cell and manufacturing method thereof 南亚塑胶工业股份有限公司 2024-04-09 CN disclosed
CN-117769109-A High-heat-conductivity metal substrate and preparation method thereof 昆山雅森电子材料科技有限公司 2024-03-26 CN disclosed
CN-1277881-C epoxy resin composition for optical semiconductor encapsulation CHANGCHUN ARTIFICIAL RESIN FAC (CN) 2006-10-04 CN disclosed
CN-1613910-A Epoxy resin composition for encapsulating optical semiconductor CHANGCHUN ARTIFICIAL RESIN FAC (CN) 2005-05-11 CN disclosed
CN-1613911-A epoxy resin composition for optical semiconductor encapsulation CHANGCHUN ARTIFICIAL RESIN FAC (CN) 2005-05-11 CN disclosed
CN-1580120-A Flame-retardant epoxy resin composition and phosphorus-containing compound CHANGCHUN ARTIFICIAL RESIN FAC (CN) 2005-02-16 CN disclosed
CN-1449031-A Semiconductor devices TOKYO SHIBAURA ELECTRIC CO (JP) 2003-10-15 CN disclosed