SCHEMBL4400623

SCHEMBL4400623

CCC(CC[O])C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12985615 0.77
SCHEMBL4395098 0.75
SCHEMBL28129649 0.75
SCHEMBL83532 0.75
SCHEMBL22414209 0.74
SCHEMBL17029117 0.74
SCHEMBL423938 0.74
SCHEMBL24651311 0.74
SCHEMBL83374 0.73
SCHEMBL10385536 0.73 TRPM8 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4372019-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
US-11834390-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2023-12-05 US disclosed
WO-2023190374-A1 DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM 日本曹達株式会社 2023-10-05 WO disclosed
US-20230118487-A1 TWO-COMPONENT ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
US-20230120998-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
EP-4130179-A1 TWO-COMPONENT ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-4130166-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
WO-2023286714-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF 日本曹達株式会社 2023-01-19 WO disclosed
US-20210347726-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2021-11-11 US disclosed
EP-3862407-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2021-08-11 EP disclosed
US-20060088786-A1 Rewritable optical information recording medium, recording and reproducing methods, as well as recording and reproducing apparatus MITSUI CHEMICALS, INC. (JP) 2006-04-27 US disclosed
US-20050208425-A1 Imide compound and optical recording media made by using the same YAMAMOTO CHEMICALS, INC. (JP) 2005-09-22 US disclosed
EP-1180765-B1 Optical recording medium and porphycene compound MITSUI CHEMICALS INC (JP) 2005-04-06 EP disclosed
EP-1484191-A1 REWRITABLE OPTICAL INFORMATION RECORDING MEDIUM AND RECORDING/REPRODUCING METHOD, RECORDING/REPRODUCING DEVICE Sony Corporation (JP) 2004-12-08 EP disclosed
EP-1445115-A1 IMIDE COMPOUNDS AND OPTICAL RECORDING MEDIA MADE BY USING THE SAME Mitsui Chemicals, Inc. (JP) 2004-08-11 EP disclosed
US-6627288-B1 Optical recording medium and porphycene compound MITSUI CHEMICALS, INC. (JP) 2003-09-30 US disclosed
US-20030091931-A1 Benzbisazole compound and optical recording medium containing the compound MITSUI CHEMICALS, INC. (JP) 2003-05-15 US disclosed
EP-1245571-A1 BENZBISAZOLE COMPOUND AND OPTICAL RECORDING MEDIUM CONTAINING THE COMPOUND Mitsui Chemicals, Inc. (JP) 2002-10-02 EP disclosed
EP-1180765-A1 Optical recording medium and porphycene compound Mitsui Chemicals, Inc. (JP) 2002-02-20 EP disclosed
US-6106999-A SENSITIVITY TO GENERAL-PURPOSE VISIBLE LIGHT LASER, SO THAT HIGH-SPEED SCANNING EXPOSURE IS POSSIBLE BY LASER, AND EXTREMELY FINE HIGH RESOLUTION CAN BE OBTAINED; CAN BE USED FOR COATING OR PRINTING UNDER SAFELIGHT IRRADIATING CONDITIONS MITSUI CHEMICALS (JP) 2000-08-22 US disclosed