SCHEMBL440471

SCHEMBL440471

[O]N1C(C2CCCC2)CCCC1C1CCCC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
SLC18A3 Q16572 3/20 0.38
CYP2D6 P10635 3/20 0.37
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
LMNA P02545 1/20 0.37
OPRM1 P35372 2/20 0.32
OPRK1 P41145 2/20 0.32
OPRL1 P41146 2/20 0.32
DPP7 Q9UHL4 1/20 0.32
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
PSEN1 P49768 1/20 0.30
PSEN2 P49810 1/20 0.30
APH1B Q8WW43 1/20 0.30
NCSTN Q92542 1/20 0.30
APH1A Q96BI3 1/20 0.30
PSENEN Q9NZ42 1/20 0.30
HSD11B1 P28845 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL439404 0.97 SLC18A3 (0.41) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL440472 0.71 GAA (0.46) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL22212582 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL22764526 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL22212620 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL24915202 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL24915061 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL24915175 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL22212589 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A
SCHEMBL24914696 0.69 GAA (0.39) ALDH1A1SLC18A3CYP2D6MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US disclosed
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US disclosed
US-20110176288-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY LTD. (JP) 2011-07-21 US disclosed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP disclosed
EP-1754762-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2007-02-21 EP disclosed