SCHEMBL439404

SCHEMBL439404

[O]N1C(C2CCCCC2)CCCC1C1CCCCC1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC18A3 Q16572 2/20 0.41
ALDH1A1 P00352 2/20 0.37
CYP2D6 P10635 3/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
LMNA P02545 1/20 0.36
GAA P10253 1/20 0.33
PKM P14618 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
HSD11B1 P28845 1/20 0.33
MAPT P10636 1/20 0.32
RIPK1 Q13546 1/20 0.32
OPRM1 P35372 1/20 0.31
OPRK1 P41145 1/20 0.31
OPRL1 P41146 1/20 0.31
DPP7 Q9UHL4 1/20 0.31
MBTD1 Q05BQ5 1/20 0.31
L3MBTL3 Q96JM7 1/20 0.31
NPC1 O15118 1/20 0.31
RAB9A P51151 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL440471 0.97 ALDH1A1 (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL22212620 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL22212582 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL22212589 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL24915175 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL24915202 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL24915061 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL24914696 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL22764526 0.72 GAA (0.39) SLC18A3ALDH1A1CYP2D6MEN1KMT2A
SCHEMBL439405 0.72 GAA (0.50) SLC18A3ALDH1A1CYP2D6MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US disclosed
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US disclosed
US-20110176288-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY LTD. (JP) 2011-07-21 US disclosed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP disclosed
EP-1754762-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2007-02-21 EP disclosed