Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 2/20 | 0.51 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.46 |
| ▸ | HPSE | Q9Y251 | 1/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | SCN9A | Q15858 | 1/20 | 0.43 |
| ▸ | APEX1 | P27695 | 1/20 | 0.41 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.41 |
| ▸ | GALK1 | P51570 | 1/20 | 0.40 |
| ▸ | CASP6 | P55212 | 1/20 | 0.40 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.40 |
| ▸ | PLEC | Q15149 | 1/20 | 0.40 |
| ▸ | EIF4E | P06730 | 1/20 | 0.40 |
| ▸ | PYGL | P06737 | 4/20 | 0.40 |
| ▸ | PYGM | P11217 | 2/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | DUSP3 | P51452 | 1/20 | 0.39 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.39 |
| ▸ | PTPN11 | Q06124 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22528190 | 0.91 | POLB (0.50) | POLBALDH1A1HPSETDP1LMNA | |
| SCHEMBL29364655 | 0.81 | POLB (0.70) | POLBALDH1A1HPSETDP1LMNA | |
| SCHEMBL29426403 | 0.81 | POLB (0.70) | POLBALDH1A1HPSETDP1LMNA | |
| SCHEMBL49365 | 0.81 | POLB (0.70) | POLBALDH1A1HPSETDP1LMNA | |
| SCHEMBL8924039 | 0.81 | POLB (0.46) | POLBALDH1A1TDP1LMNAAPEX1 | |
| SCHEMBL523943 | 0.81 | POLB (0.58) | POLBALDH1A1HPSETDP1LMNA | |
| SCHEMBL695791 | 0.81 | POLB (0.54) | POLBHPSETDP1LMNAL3MBTL1 | |
| SCHEMBL30901880 | 0.79 | POLB (0.73) | POLBALDH1A1HPSETDP1LMNA | |
| SCHEMBL145176 | 0.79 | POLB (0.73) | POLBALDH1A1HPSETDP1LMNA | |
| Water SCHEMBL6407539 | 0.79 | POLB (0.68) | POLBALDH1A1HPSETDP1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4553101-B1 | A POLYMIDE VARNISH AND PREPARATION METHOD AND USE THEREOF | NINGBO BOYA POLY ADVANCED MAT CO LTD (CN) | 2025-10-08 | — | — | EP | claimed |
| EP-4553101-A1 | A POLYMIDE VARNISH AND PREPARATION METHOD AND USE THEREOF | Ningbo Boya Poly Advanced Materials Co., Ltd. (CN) | 2025-05-14 | — | — | EP | claimed |
| CN-118271610-A | Polyamic acid slurry for optical fiber and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2024-07-02 | — | — | CN | claimed |
| CN-118271609-A | Polyamic acid slurry and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2024-07-02 | — | — | CN | claimed |
| CN-117343637-A | Polyimide varnish, and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2024-01-05 | — | — | CN | claimed |
| CN-116903845-A | Polyalkylene oxide end-capping agent, polyimide film with low dielectric constant, and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2023-10-20 | — | — | CN | claimed |
| CN-116903864-A | Polyamic acid slurry and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2023-10-20 | — | — | CN | claimed |
| CN-116554828-A | Water-soluble polyimide binder and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2023-08-08 | — | — | CN | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20050202337-A1 | Photosensitive resin composition and method for preparing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2005-09-15 | — | — | US | disclosed |
| US-6929890-B2 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2005-08-16 | — | — | US | disclosed |
| EP-1508837-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES, INC. (JP) | 2005-02-23 | — | — | EP | disclosed |
| EP-1475665-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-11-10 | — | — | EP | disclosed |
| US-20040197703-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-10-07 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | POLB 1151/4885ALDH1A1 3706/4885HPSE 4170/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | POLB 2221/4885ALDH1A1 3281/4885HPSE 4683/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.