SCHEMBL4424420

SCHEMBL4424420

CC(C)OC(=O)N1C(C)CCCC1C

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
RECQL P46063 1/20 0.46
MGLL Q99685 1/20 0.44
ALDH1A1 P00352 3/20 0.38
HPGD P15428 2/20 0.38
GLA P06280 1/20 0.38
ACE P12821 1/20 0.37
HSD11B1 P28845 1/20 0.36
KMT2A Q03164 4/20 0.35
MEN1 O00255 2/20 0.35
CHRM1 P11229 1/20 0.35
TSHR P16473 1/20 0.34
DPP4 P27487 1/20 0.34
KDM4E B2RXH2 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13321385 1.00 RECQL (0.46) RECQLMGLLALDH1A1HPGDGLA
SCHEMBL16468333 0.92 PHGDH (0.40) RECQLMGLLALDH1A1HPGDTSHR
SCHEMBL304741 0.85 RECQL (0.43) RECQLMGLLALDH1A1HPGDGLA
SCHEMBL304740 0.85 RECQL (0.43) RECQLMGLLALDH1A1HPGDGLA
SCHEMBL13301215 0.85 RECQL (0.47) RECQLMGLLALDH1A1HPGDGLA
SCHEMBL16468175 0.79 KMT2A (0.45) RECQLMGLLALDH1A1HPGDGLA
SCHEMBL20473387 0.78 HTR2C (0.46) ALDH1A1KMT2AMEN1TSHRKDM4E
SCHEMBL12787401 0.77 GAA (0.42) ALDH1A1HPGDKMT2ADPP4
SCHEMBL4074595 0.77 ALDH1A1 (0.34) ALDH1A1HPGDKMT2AMEN1TSHR
SCHEMBL4074294 0.77 ALDH1A1 (0.34) ALDH1A1HPGDKMT2AMEN1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260022202-A1 UV-CURABLE COMPOSITION AND USE THEREOF DOW TORAY CO LTD (JP) 2026-01-22 US disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
US-12405531-B2 Organic EL display device, production method for cured product, and production method for organic EL display device TORAY INDUSTRIES, INC. (JP) 2025-09-02 US disclosed
US-12339586-B2 Photocurable resin composition containing self-crosslinkable polymer NISSAN CHEMICAL CORPORATION (JP) 2025-06-24 US disclosed
US-20250172869-A1 WAFER END PROTECTIVE-FILM FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING NISSAN CHEMICAL CORPORATION (JP) 2025-05-29 US disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
US-20250147420-A1 Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-08 US disclosed
US-20250116936-A1 PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKABLE POLYMER NISSAN CHEMICAL CORPORATION (JP) 2025-04-10 US disclosed
EP-4492142-A1 WAFER EDGE PROTECTIVE FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING Nissan Chemical Corporation (JP) 2025-01-15 EP disclosed
US-20160108250-A1 CURABLE COMPOSITION INCLUDING SILOXANE OLIGOMER AND INORGANIC FINE PARTICLES NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-04-21 US disclosed
EP-2987809-A1 CURABLE COMPOSITION COMPRISING SILOXANE OLIGOMER AND INORGANIC MICROPARTICLES Nissan Chemical Industries, Ltd. (JP) 2016-02-24 EP disclosed
US-20150293449-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-10-15 US disclosed
US-9029270-B2 Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor ASAHI KASEI E-MATERIALS CORPORATION (JP) 2015-05-12 US disclosed
US-9029270-B2 Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor ASAHI KASEI E-MATERIALS CORPORATION (JP) 2015-05-12 US disclosed
US-20150050596-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-02-19 US disclosed
US-20130168829-A1 PHENOLIC RESIN COMPOSITION, AND METHODS FOR MANUFACTURING CURED RELIEF PATTERN AND SEMICONDUCTOR ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-07-04 US disclosed
US-20130168829-A1 PHENOLIC RESIN COMPOSITION, AND METHODS FOR MANUFACTURING CURED RELIEF PATTERN AND SEMICONDUCTOR ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-07-04 US disclosed
US-8187788-B2 Photosensitive resin composition and photosensitive film ASAHI KASEI KABUSHIKI KAISHA (JP) 2012-05-29 US disclosed
US-20090191385-A1 Photosensitive Resin Composition and Photosensitive Film ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-07-30 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260022202-A1 UV-CURABLE COMPOSITION AND USE THEREOF IDUA, SEM1, ARSA RECQL 1300/4885MGLL 2293/4885ALDH1A1 232/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.