Cyclohexane

Cyclohexane

SCHEMBL442729

C1CCCCC1.C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C

nearest known ligand 0.88

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.88
TP53 P04637 3/20 0.88
HIF1A Q16665 3/20 0.88
CYP3A4 P08684 2/20 0.88
MAPK1 P28482 1/20 0.88
SMN1; SMN2 Q16637 1/20 0.88
TSHR P16473 7/20 0.47
THRB P10828 2/20 0.43
HSD17B10 Q99714 1/20 0.42
HPGD P15428 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL151566 0.94 ALDH1A1 (1.00) ALDH1A1TP53HIF1ACYP3A4MAPK1
Cyclohexane SCHEMBL4208832 0.93 ALDH1A1 (0.76) ALDH1A1TP53HIF1ACYP3A4MAPK1
Ethylene SCHEMBL21434347 0.92 ALDH1A1 (0.96) ALDH1A1TP53HIF1ACYP3A4MAPK1
Ammonia Solution, Strong SCHEMBL8679286 0.92 ALDH1A1 (0.96) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL1269051 0.92 ALDH1A1 (0.96) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL6664674 0.92 ALDH1A1 (0.96) ALDH1A1TP53HIF1ACYP3A4MAPK1
Cyclohexane SCHEMBL3808573 0.91 ALDH1A1 (0.73) ALDH1A1TP53HIF1ACYP3A4MAPK1
Ethylene Glycol SCHEMBL5276892 0.90 ALDH1A1 (0.92) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL274920 0.90 ALDH1A1 (0.91) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL123908 0.90 ALDH1A1 (0.91) ALDH1A1TP53HIF1ACYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210403701-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2021-12-30 US disclosed
US-11161975-B2 Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 2021-11-02 US disclosed
US-20190330464-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2019-10-31 US disclosed
US-20150198885-A1 LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD FUJIFILM CORPORATION (JP) 2015-07-16 US disclosed
US-8178226-B2 Film-covered electric device and method of manufacturing same NEC CORPORATION (JP) 2012-05-15 US disclosed
US-20120064381-A1 FILM-COVERED ELECTRIC DEVICE AND METHOD OF MANUFACTURING SAME FUJI JUKOGYO KABUSHIKI KAISHA (JP) 2012-03-15 US disclosed
US-8062780-B2 Film-covered electric device and method of manufacturing same NEC CORPORATION (JP) 2011-11-22 US disclosed
US-7762870-B2 Polishing pad and cushion layer for polishing pad TOYO TIRE & RUBBER CO., LTD (JP) 2010-07-27 US disclosed
US-7641540-B2 Polishing pad and cushion layer for polishing pad TOYO TIRE & RUBBER CO., LTD (JP) 2010-01-05 US disclosed
US-20090081542-A1 FILM-COVERED ELECTRIC DEVICE AND METHOD OF MANUFACTURING SAME NEC CORPORATION (JP) 2009-03-26 US disclosed
US-7329170-B2 Method of producing polishing pad TOYO TIRE & RUBBER CO., LTD. (JP) 2008-02-12 US disclosed
US-20060148391-A1 Polishing pad and cushion layer for polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2006-07-06 US disclosed
US-20060148393-A1 Polishing pad and cushion layer for polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2006-07-06 US disclosed
US-20060148392-A1 Method of producing polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2006-07-06 US disclosed
US-6638615-B2 Surface treatment of carbon fibers with polymer TORAY INDUSTRIES, INC. (JP) 2003-10-28 US disclosed