Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 7/20 | 0.67 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.67 |
| ▸ | CA1 | P00915 | 4/20 | 0.47 |
| ▸ | SLC1A2 | P43004 | 2/20 | 0.45 |
| ▸ | SLC1A1 | P43005 | 2/20 | 0.45 |
| ▸ | SLC1A3 | P43003 | 1/20 | 0.45 |
| ▸ | GRIK1 | P39086 | 2/20 | 0.40 |
| ▸ | GRIK2 | Q13002 | 2/20 | 0.40 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.39 |
| ▸ | AKR1A1 | P14550 | 1/20 | 0.39 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.39 |
| ▸ | HTR2A | P28223 | 1/20 | 0.39 |
| ▸ | HTR2C | P28335 | 1/20 | 0.39 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.39 |
| ▸ | HRH1 | P35367 | 1/20 | 0.39 |
| ▸ | DRD3 | P35462 | 1/20 | 0.39 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.39 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.39 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| 2-Ethylhexanoic Acid SCHEMBL22069985 | 0.86 | CA2 (0.71) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL28402120 | 0.85 | CA2 (0.69) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL19348930 | 0.84 | CA2 (0.95) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL517433 | 0.84 | CA2 (0.95) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| SCHEMBL8016442 | 0.83 | CA2 (0.47) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL1208050 | 0.82 | CA2 (0.77) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL5698808 | 0.82 | CA2 (0.77) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL28001398 | 0.82 | CA2 (0.83) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| 2-Ethylhexanoic Acid SCHEMBL3658908 | 0.82 | CA2 (0.83) | CA2MAPK1CA1SLC1A2SLC1A1 | |
| SCHEMBL1284591 | 0.82 | CA2 (0.54) | CA2MAPK1CA1SLC1A2SLC1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023182275-A1 | NONAQUEOUS DISPERSION COMPOSITION, ADHESIVE AGENT COMPOSITION, HEAT-SEAL LACQUER, AND COATING COMPOSITION | 三菱ケミカル株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023065803-A1 | PHOTO/THERMAL DUAL-CURING RESIN COMPOSITION, AND PREPARATION METHOD THEREFOR AND USE THEREOF | 韦尔通科技股份有限公司 | 2023-04-27 | — | — | WO | disclosed |
| WO-2023065802-A1 | POLYTHIOL COMPOUND AND PREPARATION METHOD THEREFOR, CURING AGENT, RESIN COMPOSITION AND USE THEREOF | 韦尔通科技股份有限公司 | 2023-04-27 | — | — | WO | disclosed |
| EP-3666754-B1 | FULLY CONTINUOUS FLOW PRODUCTION PROCESS FOR DIRECTLY PREPARING ORGANIC PEROXIDE FROM ALCOHOL OR ALKANE | SHANGHAI HYBRID CHEM TECH (CN) | 2023-03-29 | — | — | EP | disclosed |
| CN-114746490-A | Prepreg and molded article | DIC株式会社 | 2022-07-12 | — | — | CN | disclosed |
| EP-3666754-A1 | ONLINE FULLY CONTINUOUS FLOW PRODUCTION PROCESS FOR DIRECTLY PREPARING ORGANIC PEROXIDE FROM ALCOHOL OR ALKANE | Shanghai Hybrid-Chem Technologies (CN) | 2020-06-17 | — | — | EP | disclosed |
| CN-1931947-B | Adhesive composition for circuit connection | HITACHI CHEMICAL CO LTD | 2013-05-22 | — | — | CN | disclosed |
| US-7524559-B2 | Resin particle, conductive particle, and anisotropic conductive adhesive containing the same | SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) | 2009-04-28 | — | — | US | disclosed |
| US-7338710-B2 | Resin particle, conductive particle and anisotropic conductive adhesive containing the same | SONY CHEMICALS & INFORMATION DEVICE CORPORATION (JP) | 2008-03-04 | — | — | US | disclosed |
| US-20070299159-A1 | Resin particle, conductive particle, and anisotropic conductive adhesive containing the same | SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) | 2007-12-27 | — | — | US | disclosed |
| CN-1931947-A | Adhesive composition for circuit connection | HITACHI CHEMICAL CO LTD (JP) | 2007-03-21 | — | — | CN | disclosed |
| CN-1288219-C | Adhesive composition, adhesive composition for circuit connection, connector, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2006-12-06 | — | — | CN | disclosed |
| CN-1692149-A | Adhesive composition, adhesive composition for circuit connection, connector, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2005-11-02 | — | — | CN | disclosed |
| US-20050228144-A1 | Resin particle, conductive particle and anisotropic conductive adhesive containing the same | SONY CORPORATION (JP) | 2005-10-13 | — | — | US | disclosed |