SCHEMBL442878

SCHEMBL442878

CCC1=C([Si](OC)(OC)OC)C2CCC1C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17373003 0.81
SCHEMBL6401429 0.74
SCHEMBL2011374 0.66
SCHEMBL9064047 0.64
SCHEMBL15842100 0.60
SCHEMBL15851436 0.60
SCHEMBL2944998 0.56 ADRA1A (0.38)
SCHEMBL445871 0.55 CYP19A1 (0.32)
SCHEMBL15842162 0.55
SCHEMBL15842161 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9263416-B2 Methods and materials useful for chip stacking, chip and wafer bonding SUMITOMO BAKELITE CO., LTD. (JP) 2016-02-16 US disclosed
US-20140349446-A1 METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING PROMERUS, LLC (US) 2014-11-27 US disclosed
US-8816485-B2 Methods and materials useful for chip stacking, chip and wafer bonding SUMITOMO BAKELITE CO., LTD. (JP) 2014-08-26 US disclosed
US-8420293-B2 Optical waveguides and methods thereof SUMITOMO BAKELITE CO., LTD. (JP) 2013-04-16 US disclosed
US-20120175721-A1 Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding PROMERUS LLC (US) 2012-07-12 US disclosed
US-20120064458-A1 OPTICAL WAVEGUIDES AND METHODS THEREOF PROMERUS, LLC (US) 2012-03-15 US disclosed
US-8120168-B2 Methods and materials useful for chip stacking, chip and wafer bonding PROMERUS LLC (US) 2012-02-21 US disclosed
US-8053166-B2 Optical waveguides and methods thereof SUMITOMO BAKELITE CO. LTD. (JP) 2011-11-08 US disclosed
US-8021825-B2 Optical waveguides and methods thereof SUMITOMO BAKELITE CO., LTD. (JP) 2011-09-20 US disclosed
EP-1997138-B1 METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING PROMERUS LLC (US) 2011-09-14 EP disclosed
US-7932161-B2 Methods and materials useful for chip stacking, chip and wafer bonding PROMERUS LLC (US) 2011-04-26 US disclosed
US-7820356-B2 photo-induced thermally developable film comprising norbornene-type polyalkenamer copolymer and a procatalyst; curable; transparent or colorless, and propagation loss SUMITOMO BAKELITE CO. LTD. (JP) 2010-10-26 US disclosed
US-20100061688-A1 OPTICAL WAVEGUIDES AND METHODS THEREOF SUMITOMO BAKELITE CO., LTD. (JP) 2010-03-11 US disclosed
US-20100062378-A1 OPTICAL WAVEGUIDES AND METHODS THEREOF SUMITOMO BAKELITE CO., LTD. (JP) 2010-03-11 US disclosed
EP-1997138-A2 METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING Promerus LLC (US) 2008-12-03 EP disclosed
US-20080073741-A1 provide strong bonds while also being readily removed with little or no residues; reworkable; semiconductor; norbornene-type polymer derived from phenethyl norbornene, or glycidyl methyl ether norbornene or decyl norbornene PROMERUS LLC (US) 2008-03-27 US disclosed
US-20070232026-A1 Methods and materials useful for chip stacking, chip and wafer bonding PROMERUS LLC (US) 2007-10-04 US disclosed
WO-2007109326-A2 METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING PROMERUS LLC (US) 2007-09-27 WO disclosed
US-20070148566-A1 Optical waveguides and methods thereof SUMITOMO BAKELITE CO., LTD. (JP) 2007-06-28 US disclosed