SCHEMBL4429201

SCHEMBL4429201

CCCCOC=C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4430804 0.92 CES2 (0.40)
SCHEMBL4437405 0.90 CES2 (0.43)
SCHEMBL14939281 0.90 CES2 (0.43)
SCHEMBL4425605 0.90 CES2 (0.43)
SCHEMBL4429558 0.90 CES2 (0.43)
SCHEMBL5077032 0.90 CES2 (0.43)
SCHEMBL4427588 0.90 CES2 (0.43)
SCHEMBL4432502 0.90 CES2 (0.43)
SCHEMBL4429063 0.90 CES2 (0.43)
SCHEMBL4430294 0.86 TSHR (0.48)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106795324-B The plasticizer composition of cycloalkyl ester and terephthalate comprising saturated dicarboxylic acid 巴斯夫欧洲公司 2019-06-14 CN disclosed
CN-107108958-B Plasticizer composition comprising cycloalkyl esters of saturated dicarboxylic acids and 1, 2-cyclohexanedicarboxylic acid esters 巴斯夫欧洲公司 2019-06-14 CN disclosed
CN-109196034-A Polymer compositions comprising cycloalkylalkyl dicarboxylic diesters as plasticizers 巴斯夫欧洲公司 2019-01-11 CN disclosed
CN-108699289-A Plasticizer composition comprising aliphatic dicarboxylic acid ester and diester selected from 1, 2-cyclohexane dicarboxylic acid ester and terephthalic acid ester 巴斯夫欧洲公司 2018-10-23 CN disclosed
CN-107108958-A Plasticizer composition comprising cycloalkyl esters of saturated dicarboxylic acids and 1, 2-cyclohexanedicarboxylic acid esters 巴斯夫欧洲公司 2017-08-29 CN disclosed
CN-106795324-A The plasticizer composition of cycloalkyl ester and terephthalate comprising saturated dicarboxylic acid 巴斯夫欧洲公司 2017-05-31 CN disclosed
EP-2272813-B1 Copper-catalyzed formation of carbon-oxygen bonds MASSACHUSETTS INST TECHNOLOGY (US) 2016-11-16 EP disclosed
US-9067955-B2 Copper-catalyzed formation of carbon-heteroatom and carbon—carbon bonds MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2015-06-30 US disclosed
US-7544461-B2 Near infrared ray activation type positive resin composition KANSAI PAINT CO., LTD. (JP) 2009-06-09 US disclosed
US-7358030-B2 Process for producing ether compound KYOWA YUKA CO., LTD. (JP) 2008-04-15 US disclosed
US-20070259279-A1 Near Infrared Ray Activation Type Positive Resin Composition KANSAI PAINT CO., LTD. (JP) 2007-11-08 US disclosed
EP-1788432-A1 POSITIVE RESIN COMPOSITION OF NEAR-INFRARED-RAY ACTIVATION TYPE Kansai Paint Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20060074262-A1 Process for producing ether compound KYOWA YUKA CO., LTD. (JP) 2006-04-06 US disclosed
US-7015363-B2 Process for producing ether compound KYOWA YUKA CO., LTD. (JP) 2006-03-21 US disclosed
US-20040181097-A1 Process for producing ether compound KYOWA YUKA CO., LTD. (JP) 2004-09-16 US disclosed
EP-1415968-A1 PROCESS FOR PRODUCING ETHER COMPOUND Kyowa Yuka Co., Ltd. (JP) 2004-05-06 EP disclosed
US-4814254-A USING AN ELECTROCONDUCTIVE SUBSTANCE AND A POLYMER HAVING A GLASS TRANSITION TEMPERATURE OF NOT HIGHER THAN 40 DEGREES C. AND A MELTING POINT OF NOT HIGHER THAN 180 DEGREES C.; PHOTOTHERMOGRAPHY FUJI PHOTO FILM CO., LTD. (JP) 1989-03-21 US disclosed