Biphenyl

Biphenyl

SCHEMBL4430627

Oc1ccccc1.c1ccc(-c2ccccc2)cc1.c1cnnnc1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP3 P08254 1/20 0.56
BCL2L1 Q07817 1/20 0.56
CA12 O43570 1/20 0.52
CA1 P00915 1/20 0.52
CA2 P00918 1/20 0.52
GLA P06280 1/20 0.52
CA3 P07451 1/20 0.52
CA4 P22748 1/20 0.52
CA9 Q16790 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
CA14 Q9ULX7 1/20 0.52
NOTUM Q6P988 1/20 0.44
HSD17B1 P14061 3/20 0.43
HSD17B2 P37059 3/20 0.43
ALDH1A1 P00352 2/20 0.43
MEN1 O00255 5/20 0.42
KMT2A Q03164 5/20 0.42
ESR1 P03372 4/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2C9 P11712 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL5509919 0.93 CA12 (0.61) MMP3BCL2L1CA12CA1CA2
Phenol SCHEMBL723357 0.93 CA12 (0.61) MMP3BCL2L1CA12CA1CA2
Phenol SCHEMBL27969880 0.93 CA12 (0.61) MMP3BCL2L1CA12CA1CA2
Phenol SCHEMBL28844311 0.90 CA12 (0.58) MMP3BCL2L1CA12CA1CA2
Biphenyl SCHEMBL790630 0.87 ALDH1A1 (0.56) MMP3BCL2L1TDP1NOTUMALDH1A1
Biphenyl SCHEMBL418438 0.87 ALDH1A1 (0.56) MMP3BCL2L1TDP1NOTUMALDH1A1
Biphenyl SCHEMBL790623 0.87 ALDH1A1 (0.56) MMP3BCL2L1TDP1NOTUMALDH1A1
Phenol SCHEMBL2206202 0.86 CA12 (0.52) MMP3BCL2L1CA12CA1CA2
Naphthalene SCHEMBL28246251 0.86 CA12 (0.52) MMP3BCL2L1CA12CA1CA2
Phenol SCHEMBL6131180 0.86 TDP1 (0.52) MMP3BCL2L1CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1642917-B1 EPOXY RESIN COMPOSITION NEC CORP (JP) 2013-03-27 EP disclosed
CN-101633724-B Epoxy resin composition NIPPON ELECTRIC CO 2012-04-25 CN disclosed
CN-101633724-A Epoxy resin composition NIPPON ELECTRIC CO 2010-01-27 CN disclosed
CN-100549059-C Epoxy resin composition NIPPON ELECTRIC CO ARISAWA SEI (JP) 2009-10-14 CN disclosed
EP-1260551-B1 FLAME-RETARDANT EPOXY RESIN COMPOSITION AND LAMINATE MADE WITH THE SAME NEC CORP (JP) 2009-01-14 EP disclosed
US-20070060720-A1 Epoxy resin composition ARISAWA MANUFACTURING CO., LTD. (JP) 2007-03-15 US disclosed
CN-1816581-A Epoxy resin composition NIPPON ELECTRIC CO (JP) 2006-08-09 CN disclosed
EP-1642917-A1 EPOXY RESIN COMPOSITION NEC Corporation (JP) 2006-04-05 EP disclosed
CN-1169878-C Flame-retardant epoxy resin composition and liminate made with same �ձ�������ʽ���� 2004-10-06 CN disclosed
US-6730402-B2 MIXTURE OF EPOXY RESIN, PHENOLIC RESIN CURING AGENTS AND METAL HYDROXIDE NEC CORPORATION (JP) 2004-05-04 US disclosed
US-20030152776-A1 Flame-retardant epoxy resin composition and laminate made with the same NEC CORPORATION (JP) 2003-08-14 US disclosed
CN-1390246-A Flame-retardant epoxy resin composition and liminate made with same NIPPON ELECTRIC CORP (JP) 2003-01-08 CN disclosed
EP-1260551-A1 FLAME-RETARDANT EPOXY RESIN COMPOSITION AND LAMINATE MADE WITH THE SAME NEC Corporation (JP) 2002-11-27 EP disclosed