SCHEMBL443292

SCHEMBL443292

C[C]CCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1694238 0.89
SCHEMBL303101 0.87 TSHR (0.41)
SCHEMBL4871727 0.86 TSHR (0.53)
SCHEMBL1695033 0.86
SCHEMBL9116091 0.86 TSHR (0.53)
SCHEMBL1694520 0.86 TSHR (0.53)
SCHEMBL1694524 0.86
SCHEMBL9116108 0.86 TSHR (0.53)
Bicarbonate SCHEMBL9238736 0.76 PTPN7 (0.50)
SCHEMBL1141022 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 639 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240050337-A1 A MIXTURE COMPRISING 1,2-ALKANEDIOLS SYMRISE AG (DE) 2024-02-15 US claimed
US-20230242532-A1 TETRACYCLIC PYRIMIDINONE COMPOUND, PREPARATION METHOD THEREFOR, AND COMPOSITION AND USE THEREOF NEUSCO BIOTECH LIMITED (CN) 2023-08-03 US claimed
WO-2023126259-A1 ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT REDUCTION AGENT BASF SE (DE) 2023-07-06 WO claimed
US-20230203695-A1 Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent BASF SE (DE) 2023-06-29 US claimed
CN-114059125-A Cobalt plating compositions comprising additives for void-free sub-micron structure filling 巴斯夫欧洲公司 2022-02-18 CN claimed
CN-109477234-B Cobalt plating compositions comprising additives for void-free sub-micron structure filling 巴斯夫欧洲公司 2021-12-10 CN claimed
EP-3885475-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-09-29 EP claimed
EP-3485069-B1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-04-28 EP claimed
US-20210040635-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-02-11 US claimed
EP-3191530-B1 SOLUTION POLYMERS INCLUDING ONE OR MORE 1,1-DISUBSTITUTED ALKENE COMPOUNDS, SOLUTION POLYMERIZATION METHODS, AND POLYMER COMPOSITIONS SIRRUS INC (US) 2020-11-11 EP claimed
EP-3485069-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2019-05-22 EP claimed
CN-109477234-A Cobalt plating compositions comprising additives for void-free sub-micron structure filling 巴斯夫欧洲公司 2019-03-15 CN claimed
WO-2018053183-A1 COMPOSITION FOR THE PERMANENT DEFORMATION OF HAIR HAVING REDUCED ODOUR NOXELL CORPORATION (US) 2018-03-22 WO claimed
EP-3295925-A1 COMPOSITION FOR THE PERMANENT DEFORMATION OF HAIR HAVING REDUCED ODOUR Noxell Corporation (US) 2018-03-21 EP claimed
WO-2018048933-A1 HAIR COLORING OR BLEACHING COMPOSITION WITH REDUCED ODOR NOXELL CORPORATION (US) 2018-03-15 WO claimed
CN-107474527-A A kind of automobile radiators intake chamber 宁波市鄞州红岩汽配厂 2017-12-15 CN claimed
EP-3197507-A1 MALODOR REDUCTION COMPOSITIONS The Procter and Gamble Company (US) 2017-08-02 EP claimed
WO-2016049389-A1 MALODOR REDUCTION COMPOSITIONS THE PROCTER & GAMBLE COMPANY (US) 2016-03-31 WO claimed
EP-2757146-A1 Treatment compositions comprising microcapsules, primary or secondary amines, and formaldehyde scavengers The Procter & Gamble Company (US) 2014-07-23 EP claimed
CN-1281484-A Thermoplastic vulcanizates of carboxylated nitrile rubber and polyester thermoplastics ADVANCED ELASTOMER SYSTEMS (US) 2001-01-24 CN claimed