SCHEMBL4871727

SCHEMBL4871727

C[C]CCCCCCCCCCCCCC

nearest known ligand 0.53

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.53
THRB P10828 1/20 0.53
PTPN7 P35236 3/20 0.41
HMGCR P04035 1/20 0.41
DNM1 Q05193 5/20 0.40
ALDH1A1 P00352 2/20 0.40
LMNA P02545 2/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
HSD17B10 Q99714 1/20 0.40
SLC22A1 O15245 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1694524 1.00
SCHEMBL1695033 1.00
SCHEMBL1694520 1.00 TSHR (0.53) TSHRTHRBPTPN7HMGCRDNM1
SCHEMBL9116108 1.00 TSHR (0.53) TSHRTHRBPTPN7HMGCRDNM1
SCHEMBL9116091 1.00 TSHR (0.53) TSHRTHRBPTPN7HMGCRDNM1
SCHEMBL1694238 0.97
SCHEMBL443292 0.86
Bicarbonate SCHEMBL9238736 0.83 PTPN7 (0.50) TSHRPTPN7HMGCRALDH1A1MEN1
SCHEMBL23040316 0.76 PTPN7 (0.61) TSHRTHRBPTPN7HMGCRALDH1A1
SCHEMBL6745588 0.76 TSHR (0.57) TSHRTHRBPTPN7HMGCRDNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 107 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115335447-B Nucleating agent, resin composition, method for producing resin composition, and molded article 株式会社ADEKA 2023-12-29 CN disclosed
WO-2023196799-A2 PHOSPHITE-CONTAINING SORBENTS, SYSTEMS INCLUDING PHOSPHITE-CONTAINING SORBENTS, AND METHODS USING THE PHOSPHITE-CONTAINING SORBENTS GLOBAL THERMOSTAT OPERATIONS, LLC. (US) 2023-10-12 WO disclosed
CN-116601267-A Flame retardant composition, flame-retardant resin composition, and molded article 株式会社ADEKA 2023-08-15 CN disclosed
CN-107001762-B Acrylic resin composition and laminate obtained by laminating the same 株式会社艾迪科 2022-08-09 CN disclosed
WO-2021033399-A1 CHLORINE-CONTAINING RESIN COMPOSITION AND MOLDED PRODUCT THEREOF 堺化学工業株式会社 2021-02-25 WO disclosed
CN-107428954-B Light stabilizer masterbatch and method for producing same 株式会社ADEKA 2020-01-10 CN disclosed
WO-2019151236-A1 POLYCARBONATE RESIN ADDITIVE, POLYCARBONATE RESIN COMPOSITION CONTAINING SAME AND MOLDED BODY THEREOF 株式会社ADEKA 2019-08-08 WO disclosed
CN-108699291-A RESIN ADDITIVE COMPOSITION, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF 株式会社ADEKA 2018-10-23 CN disclosed
CN-107614618-A Resin additive composition and synthetic resin composition using the same 株式会社ADEKA 2018-01-19 CN disclosed
CN-107429048-A Resin additive composition and antistatic thermoplastic resin composition 株式会社ADEKA 2017-12-01 CN disclosed
CN-101193963-A Resin composition containing aluminum pigment ADEKA CORP (JP) 2008-06-04 CN disclosed
US-20070176154-A1 Flame retardant composition with improved fluidity, flame retardant resin composition and molded products AKEKA CORPORATION (JP) 2007-08-02 US disclosed
CN-1926107-A Weakly basic hindered amines having carbonate skeletons, synthetic resin compositions, and coating compositions ADEKA CORP (JP) 2007-03-07 CN disclosed
CN-1765810-A Curing polymer cement composition ASAHI DENKA KOGYO KK (JP) 2006-05-03 CN disclosed
CN-1237110-C insulated wire YAZAKI CORP (JP) 2006-01-18 CN disclosed
CN-1177001-C Resin composition for agricultural film ��绯��ҵ��ʽ���� 2004-11-24 CN disclosed
CN-1511179-A insulated wire ʸ����ҵ��ʽ���� 2004-07-07 CN disclosed
EP-0926189-B1 A macromolecular material composition and a modifier for macromolecular material HITACHI CHEMICAL CO LTD (JP) 2004-04-14 EP disclosed
CN-1336946-A Resin composition for agricultural film ASAHI DENKA KOGYO KK (JP) 2002-02-20 CN disclosed
EP-0926189-A2 A macromolecular material composition and a modifier for macromolecular material HITACHI CHEMICAL CO., LTD. (JP) 1999-06-30 EP disclosed