SCHEMBL4434352

SCHEMBL4434352

CO[Zr](OC)(OC)C1=C(C)C(C)=C(C)C1(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL9077180 0.98
SCHEMBL6855124 0.80
SCHEMBL28650697 0.79
SCHEMBL6857283 0.79
SCHEMBL6857335 0.77
SCHEMBL258135 0.72 CTSD (0.32)
SCHEMBL4428442 0.72 CTSD (0.32)
SCHEMBL6857153 0.71 CA4 (0.32)
SCHEMBL4430418 0.70 CTSD (0.31)
SCHEMBL4430868 0.70 CTSD (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
US-5608009-A OLEFIN-DIOLEFIN GRAFT POLYMER IDEMITSU KOSAN CO., LTD. (JP) 1997-03-04 US disclosed
CN-1140457-A Styrene polymer and molded article IDEMITSU PETROCHEMICAL CO (JP) 1997-01-15 CN disclosed
EP-0727446-A1 BRANCHED ETHYLENE MACROMONOMER AND POLYMER PRODUCED THEREFROM IDEMITSU KOSAN COMPANY LIMITED (JP) 1996-08-21 EP disclosed
EP-0690079-A1 ETHYLENE COPOLYMER, THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PRODUCING ETHYLENE COPOLYMER IDEMITSU KOSAN COMPANY LIMITED (JP) 1996-01-03 EP disclosed
EP-0686649-A1 PROPYLENE BLOCK COPOLYMER, PROCESS FOR PRODUCING THE SAME, AND MODIFIED COPOLYMER PRODUCED THEREFROM IDEMITSU KOSAN COMPANY LIMITED (JP) 1995-12-13 EP disclosed
EP-0683184-A1 POLYETHYLENE, THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME, AND PROCESS FOR PRODUCING POLYETHYLENE IDEMITSU KOSAN COMPANY LIMITED (JP) 1995-11-22 EP disclosed
EP-0667359-A1 OLEFIN COPOLYMERS AND PROCESS FOR PRODUCING THE SAME IDEMITSU KOSAN COMPANY LIMITED (JP) 1995-08-16 EP disclosed
US-5369196-A Production process of olefin based polymers IDEMITSU KOSAN CO., LTD. (JP) 1994-11-29 US disclosed
EP-0513380-A1 PROCESS FOR PRODUCING OLEFINIC POLYMER IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-11-19 EP disclosed
EP-0504418-A1 PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER, CYCLOOLEFIN COPOLYMER, AND COMPOSITION AND MOLDING PREPARED THEREFROM IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-09-23 EP disclosed