⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9859429 | 0.88 | — | — | |
| SCHEMBL825534 | 0.88 | — | — | |
| SCHEMBL8947178 | 0.84 | TSHR (0.32) | — | |
| SCHEMBL5612535 | 0.84 | MCHR1 (0.32) | — | |
| SCHEMBL412194 | 0.82 | — | — | |
| SCHEMBL13898345 | 0.82 | — | — | |
| SCHEMBL411310 | 0.80 | CA1 (0.33) | — | |
| SCHEMBL7535518 | 0.80 | CA1 (0.33) | — | |
| SCHEMBL36508 | 0.80 | — | — | |
| SCHEMBL413332 | 0.80 | CA1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11915925-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2024-02-27 | — | — | US | disclosed |
| US-11915925-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2024-02-27 | — | — | US | disclosed |
| WO-2023182238-A1 | TEMPORARY ADHESIVE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER LAMINATE USING THE TEMPORARY ADHESIVE | 株式会社ダイセル | 2023-09-28 | — | — | WO | disclosed |
| US-11710731-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2023-07-25 | — | — | US | disclosed |
| US-11710731-B2 | Semiconductor device manufacturing method | DAICEL CORPORATION (JP) | 2023-07-25 | — | — | US | disclosed |
| US-20210391165-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-12-16 | — | — | US | disclosed |
| US-20210384183-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-12-09 | — | — | US | disclosed |
| US-20210384184-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-12-09 | — | — | US | disclosed |
| US-20210358884-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | DAICEL CORPORATION (JP) | 2021-11-18 | — | — | US | disclosed |
| US-10947425-B2 | Adhesive | DAICEL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| US-7375145-B2 | capable of overcoming the problems such as poor cation polymerizing reaction and solvent resistance which are particularly accompanied with the conventional photosensitive inkjet ink containing, as a main component, a vinyl ether compound | TOSHIBA TEC KABUSHIKI KAISHA (JP) | 2008-05-20 | — | — | US | disclosed |
| US-7375145-B2 | capable of overcoming the problems such as poor cation polymerizing reaction and solvent resistance which are particularly accompanied with the conventional photosensitive inkjet ink containing, as a main component, a vinyl ether compound | TOSHIBA TEC KABUSHIKI KAISHA (JP) | 2008-05-20 | — | — | US | disclosed |
| EP-1528088-B1 | Inkjet ink | TOSHIBA TEC KK (JP) | 2008-02-27 | — | — | EP | disclosed |
| EP-1705230-B1 | Inkjet-ink | TOSHIBA TEC KK (JP) | 2008-02-20 | — | — | EP | disclosed |
| US-20070270520-A1 | Capable of overcoming the problems such as poor cation polymerizing reaction and solvent resistance which are particularly accompanied with the conventional photosensitive inkjet ink containing, as a main component, a vinyl ether compound | RISO TECHNOLOGIES CORPORATION (JP) | 2007-11-22 | — | — | US | disclosed |
| US-20070270520-A1 | Capable of overcoming the problems such as poor cation polymerizing reaction and solvent resistance which are particularly accompanied with the conventional photosensitive inkjet ink containing, as a main component, a vinyl ether compound | RISO TECHNOLOGIES CORPORATION (JP) | 2007-11-22 | — | — | US | disclosed |
| US-20070185224-A1 | PHOTOSENSITIVE INKJET INK | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-08-09 | — | — | US | disclosed |
| US-20070185224-A1 | PHOTOSENSITIVE INKJET INK | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-08-09 | — | — | US | disclosed |
| US-20070101898-A1 | Inkjet ink | AKIYAMA RYOZO | 2007-05-10 | — | — | US | disclosed |
| US-20070101898-A1 | Inkjet ink | AKIYAMA RYOZO | 2007-05-10 | — | — | US | disclosed |