Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | CA5A | P35218 | 1/20 | 0.31 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4435546 | 0.92 | MEN1 (0.43) | MEN1KMT2ATSHRCA5ACA5B | |
| Nitric Acid SCHEMBL1232080 | 0.81 | — | — | |
| Hydrazine SCHEMBL7613120 | 0.74 | — | — | |
| SCHEMBL338007 | 0.73 | MEN1 (0.75) | MEN1KMT2ATSHRCA5ACA5B | |
| SCHEMBL2198408 | 0.73 | MEN1 (0.75) | MEN1KMT2ATSHRCA5ACA5B | |
| SCHEMBL27753995 | 0.72 | — | — | |
| Formamide SCHEMBL28166967 | 0.72 | MEN1 (0.46) | MEN1KMT2ACA5ACA5B | |
| Formamide SCHEMBL28985251 | 0.72 | MEN1 (0.46) | MEN1KMT2ACA5ACA5B | |
| Formamide SCHEMBL31364361 | 0.72 | MEN1 (0.46) | MEN1KMT2ACA5ACA5B | |
| Hydroxyamine SCHEMBL6262231 | 0.70 | MEN1 (0.55) | MEN1KMT2ATSHRCA5ACA5B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2036098-A1 | PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF COPPER | Lam Research Corporation (US) | 2009-03-18 | — | — | EP | claimed |
| WO-2008002737-A1 | PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF COPPER | LAM RESEARCH CORPORATION (US) | 2008-01-03 | — | — | WO | claimed |
| US-7297190-B1 | Plating solutions for electroless deposition of copper | LAM RESEARCH CORPORATION (US) | 2007-11-20 | — | — | US | claimed |