SCHEMBL4435546

SCHEMBL4435546

C=CN.C=CN.O=[N+]([O-])[O-].[Cu]

nearest known ligand 0.43

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
TSHR P16473 1/20 0.33
CA5A P35218 1/20 0.31
CA5B Q9Y2D0 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4435187 0.92 MEN1 (0.43) MEN1KMT2ATSHRCA5ACA5B
Nitric Acid SCHEMBL1232080 0.81
SCHEMBL7729275 0.73 MEN1 (0.75) MEN1KMT2ATSHRCA5ACA5B
SCHEMBL143991 0.73 MEN1 (0.75) MEN1KMT2ATSHRCA5ACA5B
SCHEMBL10425712 0.73
SCHEMBL5556361 0.73
SCHEMBL1904768 0.73 MEN1 (0.75) MEN1KMT2ATSHRCA5ACA5B
SCHEMBL338007 0.73 MEN1 (0.75) MEN1KMT2ATSHRCA5ACA5B
SCHEMBL27979427 0.73
Formamide SCHEMBL31364361 0.72 MEN1 (0.46) MEN1KMT2ACA5ACA5B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2036098-A1 PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF COPPER Lam Research Corporation (US) 2009-03-18 EP claimed
WO-2008002737-A1 PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF COPPER LAM RESEARCH CORPORATION (US) 2008-01-03 WO claimed
US-7297190-B1 Plating solutions for electroless deposition of copper LAM RESEARCH CORPORATION (US) 2007-11-20 US claimed