Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL4436616

C=CC(=O)O.CCCCCCOCC.OCCOCCO

nearest known ligand 0.59

Full drug profile on Sugi Atlas →

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.59
THRB P10828 1/20 0.59
HTT P42858 1/20 0.59
KMT2A Q03164 1/20 0.59
MAPT P10636 1/20 0.59
TSHR P16473 4/20 0.50
ALDH1A1 P00352 1/20 0.45
ZDHHC20 Q5W0Z9 1/20 0.45
CES2 O00748 2/20 0.43
HCAR2 Q8TDS4 2/20 0.42
HPGD P15428 1/20 0.40
PLA2G2C Q5R387 1/20 0.39
EPHX2 P34913 1/20 0.38
USP2 O75604 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid SCHEMBL28161015 0.93 MEN1 (0.48) MEN1THRBHTTKMT2AMAPT
Triethylene Glycol SCHEMBL8462921 0.93 MEN1 (0.69) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL3677604 0.92 MEN1 (0.50) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL4287572 0.92 CES2 (0.50) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL27717763 0.90 MEN1 (0.57) MEN1THRBHTTKMT2AMAPT
Di(Hydroxyethyl)Ether SCHEMBL9306495 0.88 TSHR (0.65) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL30487679 0.88 CES2 (0.53) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL29508299 0.88 CES2 (0.53) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL28031949 0.88 CES2 (0.53) MEN1THRBHTTKMT2AMAPT
Acrylic Acid SCHEMBL27560702 0.88 CES2 (0.53) MEN1THRBHTTKMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110237151-A A kind of surface surgical anesthesia face-mask material and preparation method thereof 李会娟 2019-09-17 CN disclosed
CN-101437692-B Printing spacer material ASAHI CHEMICAL CORP (JP) 2011-02-02 CN disclosed
CN-101627339-A Photosensitive resin composition, flexographic printing plate, and method for producing flexographic printing plate ASAHI CHEMICAL CORP (JP) 2010-01-13 CN disclosed
US-7592540-B2 di(ethylene glycol) 2-ethylhexyl ether acrylate monomer, photoinitiator (benzoylperoxide), and lithium salt (LiPF6); suppresses volatilization of redox electrolyte and provides stable photoelectrochemical properties against environmental changes; high voltage and high photoelectric conversion efficiency SAMSUNG SDI CO., LTD. (KR) 2009-09-22 US disclosed
CN-101437692-A Printing spacer material ASAHI CHEMICAL CORP (JP) 2009-05-20 CN disclosed
EP-1724871-B1 Composition for Preparing Polymer Electrolyte for use in Dye-Sensitized Solar Cell SAMSUNG SDI CO LTD (KR) 2009-03-04 EP disclosed
EP-1724871-A1 Composition for Preparing Polymer Electrolyte for use in Dye-Sensitized Solar Cell Samsung SDI Co., Ltd. (KR) 2006-11-22 EP disclosed
US-20060254640-A1 di(ethylene glycol) 2-ethylhexyl ether acrylate monomer, photoinitiator (benzoylperoxide), and lithium salt (LiPF6); suppresses volatilization of redox electrolyte and provides stable photoelectrochemical properties against environmental changes; high voltage and high photoelectric conversion efficiency SAMSUNG SDI CO., LTD. (KR) 2006-11-16 US disclosed
EP-0604949-B1 Actinic-radiation-curing hot-melt pressure-sensitive adhesive composition MITSUI TOATSU CHEMICALS (JP) 1996-10-23 EP disclosed
US-5384341-A Melt viscosity stability, coating workability MITSUI TOATSU CHEMICALS, INC. (JP) 1995-01-24 US disclosed
EP-0604949-A2 Actinic-radiation-curing hot-melt pressure-sensitive adhesive composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-07-06 EP disclosed