Bicarbonate

Bicarbonate

SCHEMBL443692

FC(F)C(F)(F)C(F)(F)C(F)(F)F.O=C(O)O

nearest known ligand 0.43

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GSK3AGSK3BIMPA1

The experimentally established mechanism targets of Bicarbonate. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.43
KDM4E B2RXH2 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
THRB P10828 1/20 0.40
USP2 O75604 1/20 0.31
MAPT P10636 1/20 0.31
GAA P10253 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6536446 0.85 KDM4E (0.40) TSHRKDM4ETDP1
SCHEMBL37506 0.85 KDM4E (0.40) TSHRKDM4ETDP1
Ammonia Solution, Strong SCHEMBL956721 0.82 KDM4E (0.39) TSHRKDM4ETDP1
SCHEMBL3742415 0.82 KDM4E (0.39) TSHRKDM4ETDP1
SCHEMBL3735353 0.82 KDM4E (0.39) TSHRKDM4ETDP1
SCHEMBL3736916 0.82 KDM4E (0.39) TSHRKDM4ETDP1
Fluoride SCHEMBL11766154 0.82 KDM4E (0.39) TSHRKDM4ETDP1
Iodide SCHEMBL11068952 0.82 KDM4E (0.39) TSHRKDM4ETDP1
SCHEMBL956137 0.82 KDM4E (0.39) TSHRKDM4ETDP1
Potassium SCHEMBL29674780 0.82 KDM4E (0.39) TSHRKDM4ETDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109559980-B Method of manufacturing integrated circuit device 三星电子株式会社 2024-02-23 CN disclosed
US-20220181146-A1 METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2022-06-09 US disclosed
US-11069580-B2 Method of manufacturing a semiconductor device including a plurality of channel patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-07-20 US disclosed
US-20210013110-A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF CHANNEL PATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-01-14 US disclosed
US-10732506-B2 Method of fabricating integrated circuit devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2020-08-04 US disclosed
US-20190096662-A1 METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICES SAMSUNG ELECTRONICS CO., LTD (KR) 2019-03-28 US disclosed
US-10134606-B2 Method of forming patterns and method of manufacturing integrated circuit device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-11-20 US disclosed
US-9773672-B2 Method of forming micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-09-26 US disclosed
US-9613821-B2 Method of forming patterns and method of manufacturing integrated circuit device SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-04-04 US disclosed
US-9437452-B2 Method of forming a fine pattern by using block copolymers SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-09-06 US disclosed
US-20140004705-A1 METHOD OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE BY USING DOUBLE PATTERNING PROCESS WHICH USES ACID DIFFUSION SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-01-02 US disclosed
US-8431331-B2 Method of forming fine patterns of semiconductor device by using double patterning process which uses acid diffusion SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-04-30 US disclosed
US-8314036-B2 Methods of forming fine patterns of semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-11-20 US disclosed
US-20120064724-A1 Methods of Forming a Pattern of Semiconductor Devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed
US-20120064463-A1 Method of Forming Micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed
CN-102347216-A Method of manufacturing semiconductor device using acid diffusion SAMSUNG ELECTRONICS CO LTD 2012-02-08 CN disclosed
US-20120028434-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING ACID DIFFUSION SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-02-02 US disclosed
US-20110244689-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-10-06 US disclosed
US-20110027993-A1 METHODS OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KP) 2011-02-03 US disclosed
US-20090274980-A1 METHOD OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE BY USING DOUBLE PATTERNING PROCESS WHICH USES ACID DIFFUSION SAMSUNG ELECTRONICS CO., LTD. 2009-11-05 US disclosed