⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20601877 | 0.69 | — | — | |
| SCHEMBL1147762 | 0.69 | — | — | |
| SCHEMBL2986122 | 0.67 | — | — | |
| SCHEMBL21383181 | 0.67 | — | — | |
| SCHEMBL9715870 | 0.67 | — | — | |
| SCHEMBL15302262 | 0.67 | — | — | |
| Methyl Alcohol SCHEMBL11059144 | 0.65 | — | — | |
| Methyl Alcohol SCHEMBL11059150 | 0.65 | — | — | |
| SCHEMBL571013 | 0.65 | — | — | |
| SCHEMBL3620165 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3916056-B1 | HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME | SHINETSU CHEMICAL CO (JP) | 2023-12-13 | — | — | EP | disclosed |
| CN-112236482-B | Heat-conductive silicone composition and method for producing same | 信越化学工业株式会社 | 2022-12-27 | — | — | CN | disclosed |
| US-20210403785-A1 | HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-12-30 | — | — | US | disclosed |
| EP-3916056-A1 | HIGHLY THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-12-01 | — | — | EP | disclosed |
| CN-113330074-A | Highly thermally conductive silicone composition and method for producing same | 信越化学工业株式会社 | 2021-08-31 | — | — | CN | disclosed |
| US-20210253927-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-08-19 | — | — | US | disclosed |
| EP-3805317-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-04-14 | — | — | EP | disclosed |
| CN-112236482-A | Heat-conductive silicone composition and method for producing same | 信越化学工业株式会社 | 2021-01-15 | — | — | CN | disclosed |
| EP-1893692-B1 | SILICONE RUBBER COMPOSITION | DOW CORNING TORAY CO LTD (JP) | 2014-05-07 | — | — | EP | disclosed |
| US-20090312475-A1 | Silicone Rubber Composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2009-12-17 | — | — | US | disclosed |
| EP-1903087-B1 | Two part adhesive for silicone rubber which cures by addition reaction | SHINETSU CHEMICAL CO (JP) | 2008-12-31 | — | — | EP | disclosed |
| US-20080081863-A1 | Two part adhesive for silicone rubber which cures by addition reaction | SHIN-ETSU CHEMICAL CO., LTD. | 2008-04-03 | — | — | US | disclosed |
| EP-1903087-A1 | Two part adhesive for silicone rubber which cures by addition reaction | Shin-Etsu Chemical Co., Ltd. (JP) | 2008-03-26 | — | — | EP | disclosed |
| EP-1893692-A2 | SILICONE RUBBER COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2008-03-05 | — | — | EP | disclosed |
| WO-2006129887-A2 | SILICONE RUBBER COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2006-12-07 | — | — | WO | disclosed |
| EP-1021301-A1 | PLANOGRAPHIC PRINTING | Kodak Polychrome Graphics Company Ltd. (US) | 2000-07-26 | — | — | EP | disclosed |
| WO-1999014048-A1 | PLANOGRAPHIC PRINTING | KODAK POLYCHROME GRAPHICS COMPANY LTD (US) | 1999-03-25 | — | — | WO | disclosed |