SCHEMBL4444822

SCHEMBL4444822

Nc1ccccc1-c1cccc(OP(=O)(O)O)c1-c1ccccc1N

nearest known ligand 0.53

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
INPPL1 O15357 8/20 0.53
INPP5A Q14642 5/20 0.53
INPP5B P32019 2/20 0.53
SRC P12931 5/20 0.44
ALDH1A1 P00352 3/20 0.44
KDM4E B2RXH2 1/20 0.44
USP2 O75604 1/20 0.44
HPGD P15428 1/20 0.44
PDE3A Q14432 1/20 0.44
HSD17B10 Q99714 1/20 0.44
AKT1 P31749 1/20 0.43
FBP1 P09467 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
PTPRC P08575 1/20 0.36
ADORA2A P29274 1/20 0.36
LMNA P02545 1/20 0.34
RECQL P46063 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4444820 0.87 ALDH1A1 (0.45) INPPL1INPP5AINPP5BALDH1A1KDM4E
SCHEMBL28067150 0.84 INPPL1 (0.57) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL5605201 0.79 INPPL1 (0.50) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL569537 0.79 INPPL1 (0.57) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL3677648 0.77 INPPL1 (0.49) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL15811768 0.77 INPPL1 (0.49) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL28678394 0.77 INPPL1 (0.55) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL28687913 0.77 INPPL1 (0.55) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL28665448 0.77 INPPL1 (0.55) INPPL1INPP5AINPP5BSRCALDH1A1
SCHEMBL2932702 0.76 INPPL1 (0.47) INPPL1INPP5AINPP5BSRCALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2009295689-A ADHESIVE FILM FOR MULTILAYER PRINTED WIRING BOARD SHOWA HIGHPOLYMER CO LTD 2009-12-17 JP disclosed
JP-2009292895-A RESIN COMPOSITION FOR SEMICONDUCTOR SEALING SHOWA HIGHPOLYMER CO LTD 2009-12-17 JP disclosed