SCHEMBL4445817

SCHEMBL4445817

C=CC(=O)OCCOc1ccccc1-c1ccc(C(C)C)cc1

nearest known ligand 0.50

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.50
KDM4E B2RXH2 7/20 0.44
ALDH1A1 P00352 5/20 0.44
HTT P42858 3/20 0.44
USP2 O75604 2/20 0.43
KMT2A Q03164 3/20 0.43
SMN1; SMN2 Q16637 3/20 0.43
MEN1 O00255 2/20 0.43
PKM P14618 1/20 0.43
GAA P10253 1/20 0.42
LMNA P02545 1/20 0.42
MAPT P10636 1/20 0.42
MAPK1 P28482 1/20 0.42
FABP3 P05413 1/20 0.41
FABP4 P15090 1/20 0.41
ADRB2 P07550 2/20 0.41
ADRB1 P08588 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29084009 0.92 THRB (0.45) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL4445823 0.86 THRB (0.51) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL29613033 0.86 THRB (0.63) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL534826 0.86 THRB (0.63) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL29084006 0.84 THRB (0.43) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL10712230 0.83 THRB (0.66) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL25123477 0.82 USP2 (0.61) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL7624262 0.82 USP2 (0.61) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL28868051 0.81 KDM4E (0.50) THRBKDM4EALDH1A1HTTUSP2
SCHEMBL17723354 0.79 KMT2A (0.60) THRBKDM4EALDH1A1HTTUSP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250346787-A1 REUSABLE ELECTRO-TRIGGERED DEBONDING ADHESIVE TAPE WITH HIGH SHEAR STRENGTH AND PREPARATION METHOD THEREOF BYE POLYMER MAT CO LTD (CN) 2025-11-13 US claimed
WO-2024146375-A1 LIGHT ADJUSTING PACKAGING COMPOSITION FOR OLED, AND PACKAGING FILM AND PREPARATION METHOD THEREFOR 西安思摩威新材料有限公司 2024-07-11 WO claimed
CN-113999565-B Ultraviolet curable high refractive index printing ink and material layer 西安思摩威新材料有限公司 2023-10-20 CN claimed
CN-116716067-A Composition for packaging flexible OLED device, packaging structure and display device 西安思摩威新材料有限公司 2023-09-08 CN claimed
CN-116694293-A UV glue, perovskite quantum dot glue solution and perovskite quantum dot packaging structure 张家港钛光新材料科技有限公司 2023-09-05 CN claimed
CN-110581230-B Display panel, manufacturing method and display device 合肥鑫晟光电科技有限公司 2022-06-07 CN claimed
US-20250346787-A1 REUSABLE ELECTRO-TRIGGERED DEBONDING ADHESIVE TAPE WITH HIGH SHEAR STRENGTH AND PREPARATION METHOD THEREOF BYE POLYMER MAT CO LTD (CN) 2025-11-13 US disclosed
US-12297369-B2 Brightness enhancement film coating material and application thereof PHICHEM CORPORATION (CN) 2025-05-13 US disclosed
WO-2024146375-A1 LIGHT ADJUSTING PACKAGING COMPOSITION FOR OLED, AND PACKAGING FILM AND PREPARATION METHOD THEREFOR 西安思摩威新材料有限公司 2024-07-11 WO disclosed
CN-118184951-A Polyurethane modified epoxy acrylate resin and preparation method and application thereof 深圳市墨库新材料集团股份有限公司 2024-06-14 CN disclosed
CN-117777839-A Dual-curing high-gloss coating composition and preparation method and application thereof 长兴特殊材料(苏州)有限公司 2024-03-29 CN disclosed
US-20240076517-A1 BRIGHTNESS ENHANCEMENT FILM COATING MATERIAL AND APPLICATION THEREOF PHICHEM CORPORATION (CN) 2024-03-07 US disclosed
CN-117586693-A Coating, composite brightness enhancement film and preparation method thereof 上海飞凯材料科技股份有限公司 2024-02-23 CN disclosed
CN-116716067-A Composition for packaging flexible OLED device, packaging structure and display device 西安思摩威新材料有限公司 2023-09-08 CN disclosed
CN-116694293-A UV glue, perovskite quantum dot glue solution and perovskite quantum dot packaging structure 张家港钛光新材料科技有限公司 2023-09-05 CN disclosed
CN-114539845-A Ink-jet printing solder-resist ink composition and circuit board thereof 惠州市容大感光科技有限公司 2022-05-27 CN disclosed
US-7601764-B2 Photosensitive resin composition Axin Materials Corporation (CN) 2009-10-13 US disclosed
US-20080039544-A1 Photosensitive resin composition DAXIN MATERIALS CORPORATION 2008-02-14 US disclosed