SCHEMBL4446180

SCHEMBL4446180

[CH2]CC1CCCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL75077 0.86
SCHEMBL17107287 0.84
SCHEMBL5606046 0.80
SCHEMBL15707736 0.77
SCHEMBL28876113 0.77
SCHEMBL6658014 0.74
SCHEMBL11795351 0.74
SCHEMBL17107289 0.71
SCHEMBL15726740 0.71 DPP4 (0.30)
SCHEMBL5297 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117597233-A Laminate, laminate for outdoor use, and hard coating layer forming material 迪睿合株式会社 2024-02-23 CN disclosed
CN-112888715-B Silsesquioxane derivative composition and use thereof 东亚合成株式会社 2023-11-03 CN disclosed
WO-2023008306-A1 LAMINATE, OUTDOOR LAMINATE, AND HARD COAT LAYER-FORMING MATERIAL デクセリアルズ株式会社 2023-02-02 WO disclosed
CN-112888715-A Silsesquioxane derivative composition and use thereof 东亚合成株式会社 2021-06-01 CN disclosed
US-20210122892-A1 PREPREG AND PRODUCTION METHOD THEREFOR, SLIT TAPE PREPREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2021-04-29 US disclosed
EP-3797991-A1 PREPREG AND PRODUCTION METHOD THEREFOR, SLIT TAPE PREPREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2021-03-31 EP disclosed
CN-112313078-A Prepreg, method for producing prepreg, slit tape prepreg, and carbon fiber-reinforced composite material 东丽株式会社 2021-02-02 CN disclosed
US-20090131609-A1 Episulfide Group-Substituted Silicon Compound and Thermosetting Resin Composition Containing Same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-05-21 US disclosed
US-7381784-B2 Epoxy group-containing silicon compound and thermosetting resin composition NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-06-03 US disclosed
US-20060135723-A1 Silicon compound containing epoxy group and thermosetting resin composition NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-06-22 US disclosed
EP-1593703-A1 SILICON COMPOUND CONTAINING EPOXY GROUP AND THERMOSETTING RESIN COMPOSITION Nippon Kayaku Kabushiki Kaisha (JP) 2005-11-09 EP disclosed