SCHEMBL6658014

SCHEMBL6658014

C1CC2OC2CC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15842 0.89
SCHEMBL14569692 0.89
SCHEMBL31162289 0.89
SCHEMBL3322733 0.89
SCHEMBL2368206 0.89 KDM4E (0.33)
SCHEMBL18597177 0.85 TFPI2 (0.38)
SCHEMBL8687641 0.85 ALDH1A1 (0.33)
SCHEMBL17625602 0.85 ALDH1A1 (0.33)
Water SCHEMBL11665768 0.85
SCHEMBL12334971 0.81 ALDH1A1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8268158-B2 Plating bath and method ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-09-18 US claimed
EP-1266921-B1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2004-07-28 EP disclosed
US-20030064228-A1 Epoxy resin composition for fibre-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2003-04-03 US disclosed
EP-1266921-A1 EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2002-12-18 EP disclosed