⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3481786 | 0.78 | ALDH1A1 (0.31) | — | |
| SCHEMBL1263436 | 0.74 | — | — | |
| SCHEMBL1270674 | 0.74 | — | — | |
| SCHEMBL4081163 | 0.74 | — | — | |
| SCHEMBL1263512 | 0.74 | — | — | |
| SCHEMBL3482102 | 0.74 | CES1 (0.35) | — | |
| SCHEMBL4199411 | 0.71 | SPHK2 (0.41) | — | |
| SCHEMBL8852233 | 0.70 | ALDH1A1 (0.31) | — | |
| SCHEMBL2991962 | 0.70 | — | — | |
| SCHEMBL4453748 | 0.69 | ALDH1A1 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 135 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110128657-B | Synthesis of isotactic structure polyvinyl polysiloxane and method for preparing high tear-resistant silicone rubber | 中国航发北京航空材料研究院 | 2022-03-15 | — | — | CN | claimed |
| US-4138382-A | WATER SOLUBLE VINYL CONSTITUENT AND AN OLEFINIC HYDROLYZABLE SILANE | DOW CORNING CORPORATION (US) | 1979-02-06 | — | — | US | claimed |
| EP-4641292-A1 | SILICONE PARTICLES AND LIGHT-DIMMING LAMINATE | Sekisui Chemical Co., Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| EP-3378914-B1 | CONNECTING MATERIAL AND CONNECTION STRUCTURE | SEKISUI CHEMICAL CO LTD (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596510-A1 | LIGHT MODULATING BODY, LAMINATED GLASS, AND AUTOMOBILE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596511-A1 | LAMINATED GLASS AND AUTOMOBILE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-12288629-B2 | Conductive particles and connection structure | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-04-29 | — | — | US | disclosed |
| CN-113950778-B | Conductive particle, conductive material, and connection structure | 积水化学工业株式会社 | 2025-04-04 | — | — | CN | disclosed |
| CN-119301082-A | Dimmer, laminated glass and vehicle | 积水化学工业株式会社 | 2025-01-10 | — | — | CN | disclosed |
| CN-119301081-A | Laminated glass and vehicle | 积水化学工业株式会社 | 2025-01-10 | — | — | CN | disclosed |
| US-20250010588-A1 | COLORED RESIN PARTICLE AND DIMMER LAMINATE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-01-09 | — | — | US | disclosed |
| US-20090312475-A1 | Silicone Rubber Composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2009-12-17 | — | — | US | disclosed |
| EP-1903087-B1 | Two part adhesive for silicone rubber which cures by addition reaction | SHINETSU CHEMICAL CO (JP) | 2008-12-31 | — | — | EP | disclosed |
| US-20080081863-A1 | Two part adhesive for silicone rubber which cures by addition reaction | SHIN-ETSU CHEMICAL CO., LTD. | 2008-04-03 | — | — | US | disclosed |
| EP-1903087-A1 | Two part adhesive for silicone rubber which cures by addition reaction | Shin-Etsu Chemical Co., Ltd. (JP) | 2008-03-26 | — | — | EP | disclosed |
| EP-1893692-A2 | SILICONE RUBBER COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2008-03-05 | — | — | EP | disclosed |
| US-7291567-B2 | Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2007-11-06 | — | — | US | disclosed |
| WO-2006129887-A2 | SILICONE RUBBER COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2006-12-07 | — | — | WO | disclosed |
| US-20060024980-A1 | Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2006-02-02 | — | — | US | disclosed |
| EP-1619226-A1 | Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR Corporation (JP) | 2006-01-25 | — | — | EP | disclosed |