SCHEMBL4448962

SCHEMBL4448962

C=C(C)C(=O)OCCC[SiH](C)O

nearest known ligand 0.56

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.56
THRB P10828 1/20 0.48
POLB P06746 1/20 0.46
APEX1 P27695 1/20 0.46
HTT P42858 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
ALDH1A1 P00352 4/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19399230 0.86 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL2307199 0.86 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
Fluoride SCHEMBL28074750 0.85 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL6924051 0.85 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL2468776 0.84 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL8470085 0.83 TSHR (0.55) TSHRTHRBPOLBAPEX1HTT
SCHEMBL9847146 0.83 TSHR (0.55) TSHRTHRBPOLBAPEX1HTT
SCHEMBL6520464 0.81 TSHR (0.53) TSHRTHRBPOLBAPEX1HTT
SCHEMBL28536567 0.81 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL6036461 0.81 TSHR (0.53) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4361226-A1 INK FOR INK-JET TEXTILE PRINTING, METHOD FOR PRODUCING PRINTED OBJECT USING SAID INK, AND ARTICLE WITH FIXED IMAGE Nippon Shokubai Co., Ltd. (JP) 2024-05-01 EP disclosed
WO-2024014452-A1 RUBBER REINFORCEMENT FIBER TREATMENT AGENT, RUBBER REINFORCEMENT FIBER TREATMENT AGENT KIT, RUBBER REINFORCEMENT FIBER MANUFACTURING METHOD, RUBBER REINFORCEMENT FIBER, AND RUBBER PRODUCT 明成化学工業株式会社 2024-01-18 WO disclosed
WO-2023085233-A1 LITHIUM-ION SECONDARY BATTERY NEGATIVE ELECTRODE COMPOSITION 株式会社日本触媒 2023-05-19 WO disclosed
WO-2023048162-A1 POLYMER FLOCCULANT FOR ORE 株式会社日本触媒 2023-03-30 WO disclosed
US-20230094605-A1 RESIN EMULSION FOR WATER-BASED INK NIPPON SHOKUBAI CO., LTD. (JP) 2023-03-30 US disclosed
WO-2022270171-A1 INK FOR INK-JET TEXTILE PRINTING, METHOD FOR PRODUCING PRINTED OBJECT USING SAID INK, AND ARTICLE WITH FIXED IMAGE 株式会社日本触媒 2022-12-29 WO disclosed
EP-4011922-A1 EMULSION PARTICLE-CONTAINING AQUEOUS DISPERSION Nippon Shokubai Co., Ltd. (JP) 2022-06-15 EP disclosed
EP-3835368-A1 AQUEOUS DISPERSION, PRODUCTION METHOD THEREFOR, COATING COMPOSITION, AND COATING FILM Nippon Shokubai Co., Ltd. (JP) 2021-06-16 EP disclosed
EP-3020360-A1 RADICALLY CURABLE DENTAL COMPOSITIONS VOCO GmbH (DE) 2016-05-18 EP disclosed
US-20140221568-A1 MOLDING MATERIAL NIPPON SHOKUBAI CO., LTD. (JP) 2014-08-07 US disclosed
EP-2735588-A1 MOLDING MATERIAL Nippon Shokubai Co., Ltd. (JP) 2014-05-28 EP disclosed
US-7498382-B2 Emulsion, production method thereof and use thereof NIPPON SHOKUBAI CO., LTD. (JP) 2009-03-03 US disclosed
EP-1602682-A1 Dispersion, production method thereof and use thereof Nippon Shokubai Co.,Ltd. (JP) 2005-12-07 EP disclosed
US-20050267256-A1 Emulsion, production method thereof and use thereof NIPPON SHOKUBAI CO., LTD. (JP) 2005-12-01 US disclosed