Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 4/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.42 |
| ▸ | NPC1 | O15118 | 3/20 | 0.42 |
| ▸ | RAB9A | P51151 | 3/20 | 0.42 |
| ▸ | GLA | P06280 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 2/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | NLRP3 | Q96P20 | 1/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29549914 | 1.00 | GAA (0.45) | GAAALDH1A1LMNAMAPK1HSD17B10 | |
| SCHEMBL2514989 | 0.95 | GAA (0.46) | GAAALDH1A1LMNAMAPK1HSD17B10 | |
| SCHEMBL13227477 | 0.84 | HTT (0.44) | GAAALDH1A1LMNAMAPK1MEN1 | |
| SCHEMBL11056024 | 0.83 | GAA (0.55) | GAAALDH1A1KMT2ANPC1RAB9A | |
| SCHEMBL1841204 | 0.79 | NPC1 (0.64) | ALDH1A1LMNAMAPK1MEN1KMT2A | |
| SCHEMBL11057664 | 0.79 | GAA (0.49) | GAAALDH1A1MEN1KMT2ANPC1 | |
| SCHEMBL11056156 | 0.79 | GAA (0.49) | GAAALDH1A1MEN1KMT2ANPC1 | |
| SCHEMBL455855 | 0.79 | GAA (0.62) | GAAALDH1A1LMNAMAPK1MEN1 | |
| SCHEMBL9813714 | 0.77 | HSD17B10 (0.42) | ALDH1A1LMNAHSD17B10MEN1KMT2A | |
| SCHEMBL10680690 | 0.77 | HSD17B10 (0.42) | ALDH1A1LMNAHSD17B10MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112745497-A | Semi-aromatic polyamide resin and preparation method and application thereof | 南京开创新材料科技有限公司 | 2021-05-04 | — | — | CN | claimed |
| CN-112679728-A | Semi-aromatic polyamide resin and preparation method thereof | 南京开创新材料科技有限公司 | 2021-04-20 | — | — | CN | claimed |
| CN-115028991-A | Thermoplastic compositions and articles made therefrom | 巴斯夫欧洲公司 | 2022-09-09 | — | — | CN | disclosed |
| CN-112708269-B | Halogen-free flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product | 金发科技股份有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-114672154-A | Semi-aromatic polyamide molding composition for LED | 金发科技股份有限公司 | 2022-06-28 | — | — | CN | disclosed |
| CN-112759923-A | Glass fiber reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product | 金发科技股份有限公司 | 2021-05-07 | — | — | CN | disclosed |
| CN-112745497-A | Semi-aromatic polyamide resin and preparation method and application thereof | 南京开创新材料科技有限公司 | 2021-05-04 | — | — | CN | disclosed |
| CN-112708269-A | Halogen-free flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product | 金发科技股份有限公司 | 2021-04-27 | — | — | CN | disclosed |
| CN-112679728-A | Semi-aromatic polyamide resin and preparation method thereof | 南京开创新材料科技有限公司 | 2021-04-20 | — | — | CN | disclosed |
| CN-112679948-A | Flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product | 金发科技股份有限公司 | 2021-04-20 | — | — | CN | disclosed |
| WO-2020238440-A1 | SEMI-AROMATIC POLYAMIDE, METHOD FOR SYNTHESIS THEREOF, AND POLYAMIDE MOLDING COMPOSITION CONSISTING THEREOF | 金发科技股份有限公司 | 2020-12-03 | — | — | WO | disclosed |
| EP-2868699-A1 | RESIN COMPOSITION | Teijin Limited (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-20150105521-A1 | RESIN COMPOSITION | TEIJIN LIMITED (JP) | 2015-04-16 | — | — | US | disclosed |
| US-7550541-B2 | Resin composition and molded article, film and fiber each comprising the same | TORAY INDUSTRIES, INC. (JP) | 2009-06-23 | — | — | US | disclosed |
| US-20070260019-A1 | Resin composition and molded article, film and fiber each comprising the same | TORAY INDUSTRIES, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| US-6977117-B2 | Thermoplastic resin integrated structure | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2005-12-20 | — | — | US | disclosed |
| US-20010034407-A1 | Thermoplastic resin integrated structure | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2001-10-25 | — | — | US | disclosed |
| US-6156834-A | Polyacetal resin composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2000-12-05 | — | — | US | disclosed |
| US-6077908-A | VINYL POLYMER HAVING A PRIMARY ACID AMIDE GROUP AND AN ACID IMIDE GROUP. EXCELLENT IN HEAT STABILITY IN MOLDING AND WEATHERABILITY AND SUITED FOR USE AS A MOLDING MATERIAL FOR ELECTRIC AND ELECTRONIC PARTS AND AUTOMOTIVE PARTS. | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2000-06-20 | — | — | US | disclosed |