SCHEMBL4452327

SCHEMBL4452327

ClCCO[Si](OCCCl)(OCCCl)OCCCl

nearest known ligand 0.37

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
TP53 P04637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6551775 0.83 ALDH1A1 (0.31) ALDH1A1
SCHEMBL1314011 0.74
SCHEMBL1095770 0.72
SCHEMBL3898169 0.72 ALDH1A1 (0.33) ALDH1A1TP53
SCHEMBL11576580 0.69 ALDH1A1 (0.32) ALDH1A1TP53
SCHEMBL3801238 0.67
SCHEMBL11862418 0.67
SCHEMBL1003320 0.65
SCHEMBL11274559 0.65
SCHEMBL1314706 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3467044-B1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHINETSU CHEMICAL CO (JP) 2024-04-24 EP disclosed
EP-3530702-B1 THERMOCONDUCTIVE SILICONE COMPOSITION SHINETSU CHEMICAL CO (JP) 2024-02-21 EP disclosed
US-11248154-B2 Thermoconductive silicone composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-15 US disclosed
EP-3401366-B1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHINETSU CHEMICAL CO (JP) 2020-08-26 EP disclosed
US-10689515-B2 Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-23 US disclosed
US-10647830-B2 Thermally conductive silicone composition and cured product thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-05-12 US disclosed
US-20190292349-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-09-26 US disclosed
EP-3530702-A1 THERMOCONDUCTIVE SILICONE COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 2019-08-28 EP disclosed
US-20190256756-A1 THERMOCONDUCTIVE SILICONE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-08-22 US disclosed
EP-3467044-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF Shin-Etsu Chemical Co., Ltd. (JP) 2019-04-10 EP disclosed
EP-0488204-A2 Room Temperature-curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1992-06-03 EP disclosed
EP-0483776-A2 Room temperature-curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1992-05-06 EP disclosed
EP-0231932-B1 COATING RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-01-29 EP disclosed
US-5061749-A Polyurethane, vinyl polymer containing siloxy groups, filler and plasticizers SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 1991-10-29 US disclosed
US-4886862-A MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-12-12 US disclosed
EP-0231932-A2 Coating resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-08-12 EP disclosed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP disclosed
EP-0050453-A1 An oil-resistant gasket material and packing material Toray Silicone Company Limited (JP) 1982-04-28 EP disclosed
US-4156674-A PLATINUM OR COMPOUND THEREOF, CARBON BLACK AND A TRIAZOLE FOR SELF-EXTINGUISHING CHARACTER, CURING CATALYST AND A SILICON CONTAINING CROSSLINKER TORAY SILICONE COMPANY, LTD. (JP) 1979-05-29 US disclosed
US-4072636-A ORGANO-SILICATE MITSUBISHI CHEMICAL INDUSTRIES LIMITED (JA) 1978-02-07 US disclosed