⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL28820832 | 0.96 | — | — | |
| SCHEMBL6887940 | 0.72 | — | — | |
| SCHEMBL5460258 | 0.72 | — | — | |
| SCHEMBL12487280 | 0.69 | — | — | |
| SCHEMBL9862715 | 0.67 | — | — | |
| SCHEMBL592983 | 0.67 | — | — | |
| SCHEMBL9860543 | 0.65 | — | — | |
| SCHEMBL6023704 | 0.65 | — | — | |
| SCHEMBL10943356 | 0.65 | — | — | |
| SCHEMBL1749985 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118344594-A | Polymer brush type powder surface modifier and preparation method and application thereof | 中国科学院化学研究所 | 2024-07-16 | — | — | CN | claimed |
| CN-116082580-B | Powder surface modifier, modified powder and preparation method and application thereof | 中国科学院化学研究所 | 2025-05-06 | — | — | CN | disclosed |
| CN-118344594-A | Polymer brush type powder surface modifier and preparation method and application thereof | 中国科学院化学研究所 | 2024-07-16 | — | — | CN | disclosed |
| CN-115926636-B | High-temperature-resistant UV adhesive and preparation method thereof | 山东凯恩新材料科技有限公司 | 2023-09-19 | — | — | CN | disclosed |
| CN-116082580-A | Powder surface modifier, modified powder and preparation method and application thereof | 中国科学院化学研究所 | 2023-05-09 | — | — | CN | disclosed |
| CN-115926636-A | High-temperature-resistant UV adhesive and preparation method thereof | 山东凯恩新材料科技有限公司 | 2023-04-07 | — | — | CN | disclosed |
| CN-112574569-B | Multi-temperature response shape memory organic silicon rubber material and preparation method and application thereof | 中国科学院化学研究所 | 2022-08-16 | — | — | CN | disclosed |
| CN-112111155-B | Blended polymer material of polyalkylmethacrylate and silicone rubber, preparation method and application thereof | 中国科学院化学研究所 | 2022-04-01 | — | — | CN | disclosed |
| CN-105694045-B | Functionalization method of divinyl double-splint type oligomeric silsesquioxane | 烟台大学 | 2021-05-07 | — | — | CN | disclosed |
| CN-112574569-A | Multi-temperature response shape memory organic silicon rubber material and preparation method and application thereof | 中国科学院化学研究所 | 2021-03-30 | — | — | CN | disclosed |
| CN-104817698-A | Preparation method of organic silicon resin with alternating structure | UNIV YANTAI | 2015-08-05 | — | — | CN | disclosed |
| US-9040411-B2 | Advanced low k cap film formation process for nano electronic devices | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-05-26 | — | — | US | disclosed |
| US-20140179119-A1 | ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES | GlobalFoundries, Inc. (KY) | 2014-06-26 | — | — | US | disclosed |
| US-8664109-B2 | Advanced low k cap film formation process for nano electronic devices | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-03-04 | — | — | US | disclosed |
| US-20120202354-A1 | ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES | GLOBALFOUNDRIES INC. (US) | 2012-08-09 | — | — | US | disclosed |
| US-20120193767-A1 | ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES | GLOBALFOUNDRIES INC. (US) | 2012-08-02 | — | — | US | disclosed |
| US-8212337-B2 | Advanced low k cap film formation process for nano electronic devices | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-07-03 | — | — | US | disclosed |
| US-20090179306-A1 | ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-16 | — | — | US | disclosed |
| US-5489659-A | Catalyst component for use in the polymerization of α-olefins and process for producing α-olefin polymers using the same | MITSUBISHI CHEMICAL CORPORATION (JP) | 1996-02-06 | — | — | US | disclosed |
| US-4693927-A | MULTILAYER PROTECTIVE FILM FORMED BY PLASMA POLYMERIZATION COVERING THIN MAGNETIC METAL FILM ON SUPPORT; SCRATCH, WEATHER AND ABRASION RESISTANT | FUJI PHOTO FILM COMPANY LIMITED (JP) | 1987-09-15 | — | — | US | disclosed |