Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.67 |
| ▸ | NAAA | Q02083 | 1/20 | 0.52 |
| ▸ | DGKA | P23743 | 1/20 | 0.52 |
| ▸ | RAD52 | P43351 | 1/20 | 0.49 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.49 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.48 |
| ▸ | HTR2C | P28335 | 1/20 | 0.46 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.45 |
| ▸ | PRSS2 | P07478 | 1/20 | 0.45 |
| ▸ | PRSS3 | P35030 | 1/20 | 0.45 |
| ▸ | CES2 | O00748 | 3/20 | 0.45 |
| ▸ | CES1 | P23141 | 3/20 | 0.45 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.44 |
| ▸ | PPARG | P37231 | 3/20 | 0.43 |
| ▸ | PPARD | Q03181 | 3/20 | 0.43 |
| ▸ | PPARA | Q07869 | 3/20 | 0.43 |
| ▸ | GPR84 | Q9NQS5 | 2/20 | 0.43 |
| ▸ | HDAC11 | Q96DB2 | 2/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16264235 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL21581917 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL5309960 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL7522565 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL20604283 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL21581918 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL4454915 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL6357524 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL20604286 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 | |
| SCHEMBL1133209 | 1.00 | TSHR (0.67) | TSHRNAAADGKARAD52NPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20070269747-A1 | Lithography Technique Using Silicone Molds | DOW CORNING CORPORATION | 2007-11-22 | — | — | US | claimed |
| EP-1803033-A2 | LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS | Dow Corning Corporation (US) | 2007-07-04 | — | — | EP | claimed |
| WO-2006031455-A2 | LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS | DOW CORNING CORPORATION (US) | 2006-03-23 | — | — | WO | claimed |
| JP-54138082-A | — | — | None | — | — | JP | disclosed |
| EP-3741577-B1 | THERMAL TRANSFER SHEET | DAINIPPON PRINTING CO LTD (JP) | 2023-02-01 | — | — | EP | disclosed |
| CN-111591059-B | Thermal transfer sheet, and combination of transfer foil and thermal transfer sheet | 大日本印刷株式会社 | 2021-12-31 | — | — | CN | disclosed |
| US-20210154983-A1 | THERMAL TRANSFER SHEET AND COMBINATION OF TRANSFER FOIL AND THERMAL TRANSFER SHEET | DAI NIPPON PRINTING CO., LTD. (JP) | 2021-05-27 | — | — | US | disclosed |
| US-10953637-B2 | Thermal transfer sheet and combination of transfer foil and thermal transfer sheet | DAI NIPPON PRINTING CO., LTD. (JP) | 2021-03-23 | — | — | US | disclosed |
| EP-3741577-A1 | THERMAL TRANSFER SHEET AND COMBINATION OF TRANSFER FOIL AND THERMAL TRANSFER SHEET | Dai Nippon Printing Co., Ltd. (JP) | 2020-11-25 | — | — | EP | disclosed |
| CN-111591059-A | Thermal transfer sheet, and combination of transfer foil and thermal transfer sheet | 大日本印刷株式会社 | 2020-08-28 | — | — | CN | disclosed |
| EP-3424743-B1 | THERMAL TRANSFER SHEET AND COMBINATION OF TRANSFER FOIL AND THERMAL TRANSFER SHEET | DAINIPPON PRINTING CO LTD (JP) | 2020-08-19 | — | — | EP | disclosed |
| WO-2007087399-A1 | EPOXY FORMULATIONS FOR USE IN LITHOGRAPHY TECHNIQUES | DOW CORNING CORPORATION (US) | 2007-08-02 | — | — | WO | disclosed |
| EP-1803033-A2 | LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS | Dow Corning Corporation (US) | 2007-07-04 | — | — | EP | disclosed |
| WO-2006031455-A2 | LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS | DOW CORNING CORPORATION (US) | 2006-03-23 | — | — | WO | disclosed |
| EP-0930173-B1 | Thermal transfer method using a thermal transfer sheet and thermally transferred product | DAINIPPON PRINTING CO LTD (JP) | 2002-01-30 | — | — | EP | disclosed |
| EP-0743194-B1 | Thermal transfer sheet, thermal transfer method using same, and thermally transferred product | DAINIPPON PRINTING CO LTD (JP) | 1999-09-15 | — | — | EP | disclosed |
| EP-0930173-A1 | Thermal transfer method using a thermal transfer sheet and thermally transferred product | DAI NIPPON PRINTING CO., LTD. (JP) | 1999-07-21 | — | — | EP | disclosed |
| US-5837648-A | Thermal transfer sheet, thermal transfer method using the same, and thermally transferred product | DAI NIPPON PRINTING CO., LTD. (JP) | 1998-11-17 | — | — | US | disclosed |
| EP-0743194-A1 | Thermal transfer sheet, thermal transfer method using same, and thermally transferred product | DAI NIPPON PRINTING CO., LTD. (JP) | 1996-11-20 | — | — | EP | disclosed |
| JP-S54138082-A | METAL CLAD LAMINATE FOR PRINTED CIRCUIT BOARD, AND ITS MANUFACTURING | MATSUSHITA ELECTRIC IND CO LTD | 1979-10-26 | — | — | JP | disclosed |