SCHEMBL4547131

SCHEMBL4547131

CCC(CC)NN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL1117970 0.96
Hydrochloric Acid SCHEMBL360047 0.96
SCHEMBL29173713 0.83
SCHEMBL3376095 0.81
SCHEMBL10783897 0.81
SCHEMBL28072446 0.81
SCHEMBL15508383 0.81
SCHEMBL11251614 0.81
SCHEMBL18539310 0.81
SCHEMBL9353531 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109735859-B Application of 3-pentylhydrazine and salt thereof 中国原子能科学研究院 2020-10-09 CN claimed
CN-109735859-A A kind of new application of 3- amyl hydrazine and its salt 中国原子能科学研究院 2019-05-10 CN claimed
CN-104402794-B A kind of 3 aryl hydrazines substituted indole ketones derivants and preparation method and application 天津坤健生物制药有限公司 2017-11-10 CN claimed
CN-104402794-A 3-aryl hydrazine substituted indolone derivative, as well as preparation method and application thereof TIANJIN KUNJIAN BIOLOG PHARMACEUTICAL CO LTD 2015-03-11 CN claimed
WO-2026100487-A1 UNDERFILL MATERIAL, CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100491-A1 EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2026-05-15 WO disclosed
CN-115803323-B Amine imide compound, amine imide composition, curing agent, epoxy resin composition, process for producing amine imide compound, sealing material, and adhesive 旭化成株式会社 2025-05-16 CN disclosed
WO-2025028605-A1 CURING AGENT, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
WO-2025028598-A1 CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
WO-2025028611-A1 CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
US-20250034319-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-01-30 US disclosed
CN-118302470-A Epoxy resin composition, cured product, sealing material, and adhesive 旭化成株式会社 2024-07-05 CN disclosed
CN-1662578-A Organic silicate polymer and insulation film comprising the same LG CHEMICAL LTD (KR) 2005-08-31 CN disclosed
EP-0896582-A1 NON-DENDRITIC BACKBONE PEPTIDE CARRIER Pepresearch A/S (DK) 1999-02-17 EP disclosed
WO-1997038011-A1 NON-DENDRITIC BACKBONE PEPTIDE CARRIER PEPRESEARCH A/S (DK) 1997-10-16 WO disclosed
US-4322502-A FOAMING AN UNSATURATED POLYESTER DISSOLVED IN UNSATURATED MONOMER,A PEROXIDE, ORGANOMETALLIC PROMOTER, AND A HYDRAZINE OR HYDROAZONE UNIROYAL, INC. (US) 1982-03-30 US disclosed
EP-0048050-A1 Simultaneous expansion and cure of polyester resin composition UNIROYAL, INC. (US) 1982-03-24 EP disclosed
US-4268486-A REACTING WITH A HYDRAZINE COMPOUND AND SEPARATING TRIVALENT CHROMIUM COMPOUNDS OLIN CORPORATION (US) 1981-05-19 US disclosed
US-4213992-A Insecticidal carbamates BASF AKTIENGESELLSCHAFT (DE) 1980-07-22 US disclosed
US-3962113-A METHOD FOR ACCELERATING OXYGEN REMOVAL EMPLOYING AN AQUEOUS SOLUTION OF AN ALKYL HYDRAZINE OLIN CORPORATION (US) 1976-06-08 US disclosed