SCHEMBL454843

SCHEMBL454843

S=P([S-])(OC1CCCCC1)OC1CCCCC1.S=P([S-])(OC1CCCCC1)OC1CCCCC1.[Co+2]

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ACHE P22303 1/20 0.39
CA1 P00915 3/20 0.38
CA2 P00918 3/20 0.38
CA12 O43570 2/20 0.38
CA9 Q16790 2/20 0.38
GLA P06280 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11145584 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL11002409 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL4462925 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL4461611 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL5163998 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL11141847 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL10690873 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
Potassium Ion SCHEMBL11008887 0.95 CA1 (0.43) ACHECA1CA2CA12CA9
Zinc Ion SCHEMBL766513 0.95 ACHE (0.39) ACHECA1CA2CA12CA9
SCHEMBL4461609 0.95 ACHE (0.39) ACHECA1CA2CA12CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 197 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111497383-B Resin film for laminated glass, and process for producing the same SKC株式会社 2022-12-16 CN disclosed
US-11001039-B2 Resin film for laminated glass, and laminated glass and preparation thereof SKC CO., LTD. (KR) 2021-05-11 US disclosed
US-10662321-B2 Cyclic olefin copolymer composition and cross-linked product thereof MITSUI CHEMICALS, INC. (JP) 2020-05-26 US disclosed
CN-109130391-B Resin film for laminated glass, and process for producing the same SKC株式会社 2020-05-22 CN disclosed
US-20200094530-A1 RESIN FILM FOR LAMINATED GLASS, AND LAMINATED GLASS AND PREPARATION THEREOF SKC CO., LTD. (KR) 2020-03-26 US disclosed
US-10562277-B2 Resin film for laminated glass, and laminated glass and preparation thereof SKC CO., LTD. (KR) 2020-02-18 US disclosed
US-20180361714-A1 RESIN FILM FOR LAMINATED GLASS, AND LAMINATED GLASS AND PREPARATION THEREOF SKC CO., LTD. (KR) 2018-12-20 US disclosed
US-20180029335-A1 RESIN FILM FOR LAMINATED GLASS, LAMINATED GLASS INCLUDING THE SAME, AND VEHICLE INCLUDING THE SAME HYUNDAI MOTOR COMPANY (KR) 2018-02-01 US disclosed
EP-2423753-B1 Electrophotographic photoreceptor, and image forming apparatus and process cartridge using same RICOH CO LTD (JP) 2016-10-19 EP disclosed
EP-2469341-B1 Image bearing member and image forming method, image forming apparatus, and process cartridge RICOH CO LTD (JP) 2016-03-30 EP disclosed
US-6151468-A Electrophotographic photoconductor RICOH COMPANY, LTD. (JP) 2000-11-21 US disclosed
US-6030733-A Electrophotographic photoconductor with water vapor permeability RICOH COMPANY, LTD. (JP) 2000-02-29 US disclosed
US-5716443-A MIXTURES OF POLYDIMETHYLSILOXANE, ANOTHER POLYSILOXANE HAVING MONOMERS CONTAINING AMINOALKYL GROUPS, ORGANIC ACIDS AND AQUEOUS ORGANIC SOLVENTS TAIHO INDUSTRIES, CO., LTD. (JP) 1998-02-10 US disclosed
EP-0437374-B1 Optical molding resin composition ASAHI DENKA KOGYO KK (JP) 1996-12-27 EP disclosed
EP-0439258-B1 Actinic radiation-reactive pressure-sensitive adhesive composition ASAHI DENKA KOGYO KK (JP) 1995-05-03 EP disclosed
US-5360873-A Acrylate copolymer, polythiol compound and polyene compound, mounting semiconductor wafers ASAHI DENKA KOGYO K.K. (JP) 1994-11-01 US disclosed
US-5278199-A Comprising polythiol compounds and polyene compounds ASAHI DENKA KOGYO K.K. (JP) 1994-01-11 US disclosed
US-5236967-A Optical molding resin composition comprising polythiol-polyene compounds ASAHI DENKA KOGYO K.K. (JP) 1993-08-17 US disclosed
EP-0439258-A2 Actinic radiation-reactive pressure-sensitive adhesive composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1991-07-31 EP disclosed
EP-0437374-A2 Optical molding resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1991-07-17 EP disclosed