SCHEMBL4554719

SCHEMBL4554719

Nc1nnnc(-c2ncc[nH]2)c1N

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
NISCH Q9Y2I1 2/20 0.37
MTOR P42345 1/20 0.37
ADK P55263 1/20 0.37
ALDH1A1 P00352 3/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
CSNK1A1 P48729 1/20 0.33
TYRO3 Q06418 1/20 0.33
DYRK1B Q9Y463 1/20 0.33
KDM4E B2RXH2 1/20 0.32
PDE4A P27815 1/20 0.32
PDE4B Q07343 1/20 0.32
PDE4C Q08493 1/20 0.32
PDE4D Q08499 1/20 0.32
ADORA2A P29274 2/20 0.31
ADORA1 P30542 2/20 0.31
SMN1; SMN2 Q16637 1/20 0.30
SMPD3 Q9NY59 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9026306 0.76 NISCH (0.42) NISCHMTORADKALDH1A1MEN1
SCHEMBL5367338 0.68 RPS6KA5 (0.46) NISCHMTORADKALDH1A1MEN1
SCHEMBL81650 0.67 NISCH (0.59) NISCHMTORADKALDH1A1MEN1
SCHEMBL28425230 0.65 NISCH (0.56) NISCHMTORADKALDH1A1MEN1
Hydrochloric Acid SCHEMBL1536214 0.65 NISCH (0.56) NISCHMTORADKALDH1A1MEN1
SCHEMBL13977589 0.64 NISCH (0.50) NISCHMTORADKALDH1A1MEN1
SCHEMBL1844412 0.62 MTOR (0.33) NISCHMTORADKALDH1A1MEN1
SCHEMBL10584399 0.62 CSNK1A1 (0.45) NISCHMTORADKALDH1A1MEN1
SCHEMBL210649 0.61
SCHEMBL28803778 0.60 MKNK1 (0.54) NISCHMTORADKALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1014765-B1 Flexible printed board, polyamic acid and polyamic acid varnish containing same SONY CHEMICALS CORP (JP) 2003-03-12 EP claimed
US-6355357-B1 RUST RESISTANT POLYIMIDE INSULATING LAYER SONY CHEMICALS CORP. (JP) 2002-03-12 US claimed
EP-1014765-A2 Flexible printed board, polyamic acid and polyamic acid varnish containing same Sony Chemicals Corporation (JP) 2000-06-28 EP claimed
US-20090130468-A1 POLYAMIC ACID COMPOSITION, METHOD FOR PREPARING THE SAME, METHOD FOR PREPARING POLYIMIDE AND POLYIMIDE FLEXIBLE METAL-CLAD LAMINATES SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-05-21 US disclosed
EP-1014765-B1 Flexible printed board, polyamic acid and polyamic acid varnish containing same SONY CHEMICALS CORP (JP) 2003-03-12 EP disclosed
US-6355357-B1 RUST RESISTANT POLYIMIDE INSULATING LAYER SONY CHEMICALS CORP. (JP) 2002-03-12 US disclosed
JP-2000186143-A POLYAMIC ACID AND POLYAMIC ACID VARNISH CONTAINING THE SAME SONY CHEM CORP 2000-07-04 JP disclosed
EP-1014765-A2 Flexible printed board, polyamic acid and polyamic acid varnish containing same Sony Chemicals Corporation (JP) 2000-06-28 EP disclosed